Tough epoxy/cyanate ester resins with improved thermal stability, lower dielectric constant and loss based on unique hyperbranched polysiloxane liquid crystalline

2015 ◽  
Vol 26 (12) ◽  
pp. 1608-1618 ◽  
Author(s):  
Zhen Liu ◽  
Li Yuan ◽  
Guozheng Liang ◽  
Aijuan Gu
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Liquid Crystalline ◽  
Cyanate Ester ◽  
Dielectric Constant And Loss ◽  
Lower Dielectric Constant ◽  
Hyperbranched Polysiloxane ◽  
Cyanate Ester Resins

scholarly journals Adamantane-Modified Graphene Oxide for Cyanate Ester Resin Composites with Improved Properties

2019 ◽  
Vol 9 (5) ◽  
pp. 881 ◽  
Author(s):  
Zhicong Miao ◽  
Juntao Shi ◽  
Tianjiao Liu ◽  
Peng Li ◽  
Zhiqiang Su ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Graphene Oxide ◽  
Interfacial Polarization ◽  
Cyanate Ester ◽  
Scanning Calorimetry ◽  
Modified Graphene Oxide ◽  
Potential Applications ◽  
Cure Temperature ◽  
Modified Graphene

The conjugation of graphene and polymers has attracted great attention for the fabrication of functional hybrid nanomaterials. Here, we demonstrate the modification of graphene oxide (GO) with adamantane (AMT) through the diimide-activated amidation reaction. The modification of GO with AMT improves the dispersion and decreases the interfacial polarization of GO, causing a lower dielectric constant for the fabricated GO/AMT hybrid materials. The structures of GO/AMT were studied by Fourier transform infrared spectroscopy and Raman spectroscopy. Furthermore, the mechanical properties, thermal stability, and dielectric constant of GO/AMT composites were measured at a low cured temperature using various techniques, such as differential scanning calorimetry, thermogravimetric analysis, and dynamic mechanical thermal analysis. It was found that the synthesized GO/AMT materials with different contents were blended into cyanate ester (CE) resins, resulting in a lower cure temperature, smaller dielectric constant, higher thermal stability, and stronger water resistance. It is expected that this novel GO/AMT-CE material will have potential applications for replacing traditional thermosetting resins.

High Tg, Low Dielectric Constant Aromatic Benzoxazoles Containing Allylether Pendent Groups for Use in Microelectronic Packaging

2001 ◽  
Vol 682 ◽  
Author(s):  
Max D. Alexander ◽  
Thuy D. Dang ◽  
Christina E. Specker ◽  
Marlene Houtz ◽  
R.J. Spry ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
High Thermal Stability ◽  
Low Dielectric Constant ◽  
Microelectronic Packaging ◽  
Low Dielectric ◽  
Degradation Temperature ◽  
Low Thermal Expansion ◽  
Lower Dielectric Constant ◽  
Pendent Groups

ABSTRACTNext generation microelectronic packaging requirements are driving the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. Polymer candidates with exceptionally low dielectric constant (2.0-2.4), high thermal stability (degradation temperature higher than 400°C), high glass transition temperature (greater than 350°C), low water uptake (less than one percent), solubility in selected organic solvents, and low thermal expansion are all required. We have successfully synthesized and characterized several candidate polymers in an effort to address these needs.

Modified cyanate ester resins with lower dielectric loss, improved thermal stability, and flame retardancy

2011 ◽  
Vol 22 (12) ◽  
pp. 2617-2625 ◽  
Author(s):  
Dongxian Zhuo ◽  
Aijuan Gu ◽  
Guozheng Liang ◽  
Jiang-tao Hu ◽  
Cheng Zhou ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Loss ◽  
Flame Retardancy ◽  
Cyanate Ester ◽  
Lower Dielectric Loss ◽  
Cyanate Ester Resins

Studies on FMCM-41 reinforced cyanate ester nanocomposites for low k applications

RSC Advances ◽  
2014 ◽  
Vol 4 (101) ◽  
pp. 57759-57767 ◽  
Author(s):  
Mathivathanan Ariraman ◽  
Ramachandran Sasi kumar ◽  
Muthukaruppan Alagar
Keyword(s):  
Dielectric Constant ◽  
Cyanate Ester ◽  
Insulation Materials ◽  
Lower Dielectric Constant ◽  
Low K

The continual development of microelectronics needs insulation materials with lower dielectric constant (low k).

Annealing behavior and thermal stability of nanoporous polymer films based on high-performance Cyanate Ester Resins

2015 ◽  
Vol 120 ◽  
pp. 402-409 ◽  
Author(s):  
Kristina Gusakova ◽  
Jean-Marc Saiter ◽  
Olga Grigoryeva ◽  
Fabrice Gouanve ◽  
Alexander Fainleib ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Polymer Films ◽  
High Performance ◽  
Cyanate Ester ◽  
Annealing Behavior ◽  
Cyanate Ester Resins ◽  
Thermal Stability Of

EFFECT OF MgO ON STRUCTURE AND DIELECTRIC PROPERTIES OF CaO–Al2O3–B2O3–SiO2 GLASSES

2012 ◽  
Vol 19 (06) ◽  
pp. 1250063 ◽  
Author(s):  
ZHAO DU ◽  
XUEHONG ZHANG ◽  
YUNLONG YUE ◽  
HAITAO WU
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
Glass Network ◽  
Glass System ◽  
Dielectric Constant And Loss ◽  
Lower Dielectric Constant

The effect of MgO on structure and dielectric properties of aluminoborosilicate glasses was investigated. FTIR data indicated that glass network was mainly built by tetrahedral [ SiO4 ], [ BO4 ], [ AlO4 ] and trigonal [ BO3 ]. A small amount of AlO5 or AlO6 units also existed. The glass system was characterized with lower dielectric constant (4.17 ~ 4.6) and dielectric loss (12.3 × 10-4 ~ 14.77 × 10-4) at 1 MHz. With the increase of MgO content, the quantity of AlO5 or AlO6 units decreased. The variation of density showed a decreasing tendency. The dielectric constant and loss were all found to decrease.

Sign in / Sign up

Export Citation Format

Share Document