Novel toughened cyanate ester resin with good dielectric properties and thermal stability by copolymerizing with hyperbranched polysiloxane and epoxy resin

2011 ◽  
Vol 22 (5) ◽  
pp. 710-717 ◽  
Author(s):  
Cheng Zhou ◽  
Aijuan Gu ◽  
Guozheng Liang ◽  
Li Yuan
2010 ◽  
Vol 49 (8) ◽  
pp. 772-778 ◽  
Author(s):  
Xudong Sun ◽  
Minfeng Zeng ◽  
Cuiyun Lu ◽  
Fengyuan Yan ◽  
Chenze Qi

2019 ◽  
Vol 3 (4) ◽  
pp. 726-736 ◽  
Author(s):  
Longhui Zheng ◽  
Li Yuan ◽  
Guozheng Liang ◽  
Aijuan Gu

High-k composites with temperature-stable dielectric properties and low dielectric loss obtained through building a network with in situ-doped barium titanate foam.


2012 ◽  
Vol 476-478 ◽  
pp. 665-669 ◽  
Author(s):  
Li Yang ◽  
Miao Yin ◽  
Xiu Yun Li ◽  
Han Bing Ma

In this paper, a type of nanoporous polyhedral oligomeric silisesquioxanes (POSS) containing eight functional groups have been synthesized and mixed with diglycidyl ether of bisphenol A (DGEBA) to form epoxy resin networks with nanostructures. The cured octa(aminophenyl) silsesquioxane (1c-POSS) and DGEBA system inherently possesses higher thermal stability and higher char yield than the control epoxy resins. Furthermore, the dielectric constant of the 1c-POSS/DGEBA material (4.36) is substantially lower than that of the neat epoxy resins (4.64) as a consequence the presence of nanoporous POSS cubes in the epoxy matrix.


2011 ◽  
Vol 216 ◽  
pp. 635-639 ◽  
Author(s):  
Zeng Ping Zhang ◽  
Jian Zhong Pei ◽  
Shuan Fa Chen ◽  
Hong Zhao Du ◽  
Yong Wen

In order to improve the dielectric and overal properties of cyanate ester (CE) resin, a functional POSS monomer(octa(aminopropyl)silsesquioxane, POSS-NH2), was employed to modify CE. A series of POSS-NH2/CE hybrids (CE, CE1, CE2, CE3 and CE4) containing different content of POSS have been prepared by melt casting and then curing. The curing reaction of the resin systems were monitored by FT-IR. Dielectric properties of the hybrids were investigated in detail. FT-IR results showed the almost disappearance of the –OCN for all resin systems, suggesting the complete curing of CE using the experimental curing technique. Dielectric investigation indicates that CE1 which contains 1 wt% of POSS has the best dielectric properties with not only lowest dielectric constant but also lowest dielectric loss.


RSC Advances ◽  
2016 ◽  
Vol 6 (47) ◽  
pp. 40962-40969 ◽  
Author(s):  
Xinyi Dong ◽  
Zhijuan Zhang ◽  
Li Yuan ◽  
Guozheng Liang ◽  
Aijuan Gu

Tough, rigid and thermally resistant resins with outstanding dielectric properties were developed based on polysiloxane@polyimide core–shell microspheres and cyanate ester.


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