A compact 2D potential model for subthreshold characterization of nanoscale fully depleted short channel nanowire MOSFETs

Author(s):  
Liu Xi ◽  
Jin Xiao-Shi ◽  
Rongyan Chuai ◽  
Lee Jong-Ho
Author(s):  
Yuk L. Tsang ◽  
Xiang D. Wang ◽  
Reyhan Ricklefs ◽  
Jason Goertz

Abstract In this paper, we report a transistor model that has successfully led to the identification of a non visual defect. This model was based on detailed electrical characterization of a MOS NFET exhibiting a threshold voltage (Vt) of just about 40mv lower than normal. This small Vt delta was based on standard graphical extrapolation method in the usual linear Id-Vg plots. We observed, using a semilog plot, two slopes in the Id-Vg curves with Vt delta magnified significantly in the subthreshold region. The two slopes were attributed to two transistors in parallel with different Vts. We further found that one of the parallel transistors had short channel effect due to a punch-through mechanism. It was proposed and ultimately confirmed the cause was due to a dopant defect using scanning capacitance microscopy (SCM) technique.


2015 ◽  
Vol 118 (18) ◽  
pp. 184504 ◽  
Author(s):  
C. Navarro ◽  
M. Bawedin ◽  
F. Andrieu ◽  
B. Sagnes ◽  
F. Martinez ◽  
...  

2019 ◽  
Vol 2019 ◽  
pp. 1-12 ◽  
Author(s):  
Anjali Priya ◽  
Nilesh Anand Srivastava ◽  
Ram Awadh Mishra

In this paper, a comparative analysis of nanoscaled triple metal gate (TMG) recessed-source/drain (Re-S/D) fully depleted silicon-on-insulator (FD SOI) MOSFET has been presented for the design of the pseudo-NMOS inverter in the nanometer regime. For this, firstly, an analytical modeling of threshold voltage has been proposed in order to investigate the short channel immunity of the studied device and also verified against simulation results. In this structure, the novel concept of backchannel inversion has been utilized for the study of device performance. The threshold voltage has been analyzed by varying the parameters of the device like the ratio of metal gate length and the recessed-source/drain thickness for TMG Re-S/D SOI MOSFET. Drain-induced barrier lowering (DIBL) has also been explored in terms of recessed-source/drain thickness and the metal gate length ratio to examine short channel effects (SCEs). For the exact estimation of results, the comparison of the existing multimetal gate structures with TMG Re-S/D SOI MOSFET has also been taken under study in terms of electrostatic performance, i.e., threshold voltage, subthreshold slope, and on-off current ratio. These structures are investigated with the TCAD numerical simulator from Silvaco ATLAS. Furthermore, for the first time, TMG Re-S/D FD SOI MOSFET-based pseudo-NMOS inverter has been designed to observe the device performance at circuit levels. It has been found that the device offers high noise immunity with optimum switching characteristics, and the propagation delay of the studied circuit is recorded as 0.43 ps.


2003 ◽  
Vol 24 (4) ◽  
pp. 251-253 ◽  
Author(s):  
Sang Lam ◽  
Hui Wan ◽  
Pin Su ◽  
P.W. Wyatt ◽  
C.L. Chen ◽  
...  

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