Molecular dynamics simulation of Ag-Cu cluster growth on a thin polymer film

2018 ◽  
Vol 58 (2-3) ◽  
pp. 164-173 ◽  
Author(s):  
J.W. Abraham ◽  
M. Bonitz
2016 ◽  
Vol 119 (18) ◽  
pp. 185301 ◽  
Author(s):  
J. W. Abraham ◽  
T. Strunskus ◽  
F. Faupel ◽  
M. Bonitz

1993 ◽  
Vol 334 ◽  
Author(s):  
Michael R. Zachariah ◽  
Michael J. Carrier ◽  
Estela Blaisten-Barojas

AbstractClassical Molecular dynamics simulation of silicon cluster growth (up to 1000 atoms) have been conducted using the Stillinger-Weber 3-body interaction potential. The cluster binding energy has been fit to an expression that separates the surface and bulk contribution to the energy over a wide temperature and size range. Cluster growth simulations show that large heat release results from new bond formation at gas kinetic rates (i.e. sticking coefficient = unity). Temperature was found to be the primary controlling process parameter in the evolution of cluster morphology from an aggregate to a coalesced cluster below 1000 K, with the impact parameter playing a secondary role.


2015 ◽  
Vol 45 (2) ◽  
pp. 139-157
Author(s):  
Wangjie Xu ◽  
Junyan Li ◽  
Biao Zuo ◽  
Zhiquan Shen ◽  
Tingting He ◽  
...  

Author(s):  
Ji-Hoon Kang ◽  
Kwang-Seop Kim ◽  
Kyung-Woong Kim

Due to the direct contact between the stamp and polymer film during the nanoimprint lithography (NIL) process, the adhesion and friction are unavoidable. To investigate the effect of adhesion and friction on the pattern transfer, molecular dynamics (MD) simulation of NIL is performed. As the simulation results, the adhesion and friction forces between the stamp and polymer film are calculated and the effects of the adhesion and friction on the pattern transfer are studied.


1998 ◽  
Vol 144 (1-2) ◽  
pp. 395-401 ◽  
Author(s):  
Makoto Ito ◽  
Mitsuhiro Matsumoto ◽  
Masao Doi

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