Low-Pressure Organometallic Chemical Vapor Deposition of Indium Nitride on Titanium Dioxide Nanoparticles

ChemPhysChem ◽  
2004 ◽  
Vol 5 (10) ◽  
pp. 1615-1618 ◽  
Author(s):  
Jeng-Han Wang ◽  
M. C. Lin
1989 ◽  
Vol 169 ◽  
Author(s):  
J. M. Zhang ◽  
H. O Marcy ◽  
L .M. Tonge ◽  
B. W. Wessels ◽  
T. J. Marks ◽  
...  

AbstractFilms of the high‐Tc undoped and Pb‐doped Bi‐Sr‐Ca‐Cu‐O (BSCCO) superconductors have been prepared by low pressure organometallic chemical vapor deposition (OMCVD) using the volatile metal‐organic precursors Cu(acetylacetonate)2, Sr(dipivaloylmethanate)2, Ca(dipivaloylmethanate)2, and triphenyl bismuth. Factors which influence texture and morphology of the OMCVD‐derived films have been investigated, including the effects of annealing, doping, and substrates.


1993 ◽  
Vol 22 (12) ◽  
pp. 2133-2136 ◽  
Author(s):  
Kenkichiro Kobayashi ◽  
Toshihiro Matsubara ◽  
Shigenori Matsushima ◽  
Gengi Okada

2001 ◽  
Vol 693 ◽  
Author(s):  
Sonya D. McCall ◽  
Klaus J. Bachmann

AbstractA physico-chemical model of the High Pressure Organometallic Chemical Vapor Deposition (HPOMCVD) process that describes three dimensional transport phenomena as well as gas-phase and surface reactions underlying the growth of compound semiconductors is presented. A reduced-order model of the Organometallic Chemical Vapor Deposition of indium nitride (InN) from trimethylindium In(CH3)3 or TMI and ammonia (NH3) at elevated pressures has been developed and tested using the computational fluid dynamics code, CFD-ACE+. The model describes the flow dynamics coupled to chemical reactions and transport in the flow channel of the Compact Hard Shell Reactor, as a function of substrate temperature, total pressure and centerline flow velocity.


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