The influence of interfacial failure on the tensile S–N response of aged Arcan joints

2021 ◽  
pp. 51991
Author(s):  
Joviano António Costa ◽  
Alireza Akhavan‐Safar ◽  
Eduardo A. S. Marques ◽  
Ricardo J. C. Carbas ◽  
Lucas F. M. Silva
Keyword(s):  
Interfacial Failure

scholarly journals Interfacial failure via encapsulation of external particulates in an outward-growing thermal oxide

2011 ◽  
Vol 196 (10) ◽  
pp. 4686-4694 ◽  
Author(s):  
Keeyoung Jung ◽  
Chang-Soo Kim ◽  
Frederick S. Pettit ◽  
Gerald H. Meier
Keyword(s):  
Interfacial Failure ◽  
Thermal Oxide

Microwave-induced interfacial failure to enable debonding of composite materials for recycling

2017 ◽  
Vol 14 ◽  
pp. 29-36 ◽  
Author(s):  
Steffen Liebezeit ◽  
Anette Mueller ◽  
Barbara Leydolph ◽  
Ulrich Palzer
Keyword(s):  
Composite Materials ◽  
Interfacial Failure

scholarly journals Effect of weld nugget size on failure mode and mechanical properties of microscale resistance spot welds on Ti–1Al–1Mn ultrathin foils

2018 ◽  
Vol 10 (7) ◽  
pp. 168781401878528 ◽  
Author(s):  
Feng Chen ◽  
Shiding Sun ◽  
Zhenwu Ma ◽  
GQ Tong ◽  
Xiang Huang
Keyword(s):  
Mechanical Properties ◽  
Failure Mode ◽  
Failure Modes ◽  
Mechanical Performance ◽  
Weld Nugget ◽  
Interfacial Failure ◽  
Spot Welds ◽  
Resistance Spot ◽  
Resistance Spot Welds ◽  
Pullout Failure

We use tensile–shear tests to investigate the failure modes of Ti–1Al–1Mn microscale resistance spot welds and to determine how the failure mode affects the microstructure, microhardness profile, and mechanical performance. Two different failure modes were revealed: interfacial failure mode and pullout failure mode. The welds that fail by pullout failure mode have much better mechanical properties than those that fail by interfacial failure mode. The results show that weld nugget size is also a principal factor that determines the failure mode of microscale resistance spot welds. A minimum weld nugget size exists above which all specimens fail by pullout failure mode. However, the critical weld nugget sizes calculated using the existing recommendations are not consistent with the present experimental results. We propose instead a modified model based on distortion energy theory to ensure pullout failure. Calculating the critical weld nugget size using this model provides results that are consistent with the experimental data to high accuracy.

Low Stress Under Bump Metallizations for Direct Chip Attach

1998 ◽  
Vol 555 ◽  
Author(s):  
P. Su ◽  
T. M. Korhonen ◽  
S. J. Hong ◽  
M. A. Korhonen ◽  
C. Y. Li
Keyword(s):  
Flip Chip ◽  
Semiconductor Industry ◽  
Organic Substrate ◽  
Organic Substrates ◽  
Under Bump Metallization ◽  
Interfacial Failure ◽  
Stress Measurements ◽  
Rapid Reaction

AbstractIn order to use a flip chip method for bonding the Si chip directly to an organic substrate, compatible under bump metallization (UBM) must be available. Conventional schemes with a copper-based solderable layer are not well compatible with the high-tin solders (such as eutectic Pb-Sn) used with organic substrates. This is due to the rapid reaction between Sn and Cu which depletes the UBM of copper. Ni-based schemes exhibit slower reaction with the solder and have been identified by the semiconductor industry as preferable replacements to Cu-based UBM's. However, Ni-containing metallurgies are often associated with high stresses, which results in poor practical adhesion between the silicon chip and the metallization, leading to interfacial failure during fabrication or service. In this research, several nickel-containing UBM schemes are studied experimentally. Stress measurements are made for each metallization before patterning of UBM pads. An optimal Ni concentration for the UBM is suggested based on the results from this study.

Interfacial Failure In Ti/Sio2 and Ti/AIN System And Temperature Dependence Of Hardness Of AIN

1989 ◽  
Vol 167 ◽  
Author(s):  
T. Liu ◽  
R. Notis ◽  
Y. T. Chou
Keyword(s):  
Temperature Dependence ◽  
Room Temperature ◽  
Interfacial Failure ◽  
Load Dependence

AbstractThe load dependence of interracial failure induced by microindentation has been studied. It is demonstrated experimentally that substrate lateral defects induced by indentation contribute significantly to interracial failure. The microhardness of translucent AIN was measured at temperatures up to 1200°C. The hardness decreased from 10.6GPa at room temperature to 4.0GPa at 1200°C.

Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint

2011 ◽  
pp. 121-121-18
Author(s):  
Feng Gao ◽  
Jianping Jing ◽  
Frank Z. Liang ◽  
Richard L. Williams ◽  
Jianmin Qu
Keyword(s):  
Solder Joint ◽  
Failure Mode ◽  
Lead Free ◽  
Lead Free Solder ◽  
Interfacial Failure ◽  
Free Solder

scholarly journals Onset of localization in heterogeneous interfacial failure

2012 ◽  
Vol 86 (2) ◽  
Author(s):  
Arne Stormo ◽  
Knut Skogstrand Gjerden ◽  
Alex Hansen
Keyword(s):  
Interfacial Failure
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