Influences of exfoliated graphite on structures, thermal stability, mechanical modulus, and electrical resistivity of poly(butylene terephthalate)

2012 ◽  
Vol 125 (S1) ◽  
pp. E532-E540 ◽  
Author(s):  
Meilu Li ◽  
Young Gyu Jeong
Keyword(s):  
Thermal Stability ◽  
Electrical Resistivity ◽  
Exfoliated Graphite ◽  
Butylene Terephthalate ◽  
Mechanical Modulus

Thermal stability and electrical resistivity of 14N-implanted nickel contacts on n+-Si

1983 ◽  
Vol 107 (1) ◽  
pp. 67-71 ◽  
Author(s):  
T. Banwell ◽  
M.-A. Nicolet ◽  
D.M. Scott
Keyword(s):  
Thermal Stability ◽  
Electrical Resistivity

Effect of composition on thermal stability and electrical resistivity of Ta–Si–N films

2000 ◽  
Vol 365 (1) ◽  
pp. 19-21 ◽  
Author(s):  
J.O Olowolafe ◽  
I Rau ◽  
K.M Unruh ◽  
C.P Swann ◽  
Z.S Jawad ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Electrical Resistivity

Thermo-electrical behaviour of cyclic olefin copolymer/exfoliated graphite nanoplatelets nanocomposites foamed through supercritical carbon dioxide

2019 ◽  
Vol 55 (3) ◽  
pp. 263-282 ◽  
Author(s):  
A Dorigato ◽  
A Biani ◽  
W Bonani ◽  
A Pegoretti
Keyword(s):  
Carbon Dioxide ◽  
Electrical Resistivity ◽  
Supercritical Carbon Dioxide ◽  
Surface Heating ◽  
Exfoliated Graphite ◽  
Cyclic Olefin Copolymer ◽  
Graphite Nanoplatelets ◽  
Cyclic Olefin ◽  
Exfoliated Graphite Nanoplatelets ◽  
Supercritical Carbon

In this work, novel electrically conductive cyclic olefin copolymer/exfoliated graphite nanoplatelets foams were prepared through a supercritical carbon dioxide treatment starting from the corresponding unfoamed materials prepared by melt compounding, in order to investigate their thermo-electrical properties. For both unfoamed and foamed samples, the exfoliated graphite nanoplatelets introduction led to a systematic enhancement of the thermal degradation temperature. Dynamic-mechanical thermal analysis revealed that the nanofiller addition promoted an enhancement of the storage modulus and of the glass transition temperature over the whole range of the applied foaming pressures. While for unfoamed materials exfoliated graphite nanoplatelets introduction determined an important decrease of the electrical resistivity, the foaming process induced the breakage of the conductive path, with a consequent increase of electrical resistivity. Evaluation of the surface heating upon voltage application showed that the surface temperature of unfoamed materials could be noticeably increased at relatively low voltage levels, while a less pronounced surface heating could be obtained with the corresponding nanocomposite foams.

High thermal stability and low electrical resistivity carbon-containing Cu film on barrierless Si

2010 ◽  
Vol 96 (18) ◽  
pp. 182105 ◽  
Author(s):  
L. F. Nie ◽  
X. N. Li ◽  
J. P. Chu ◽  
Q. Wang ◽  
C. H. Lin ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Electrical Resistivity ◽  
High Thermal Stability ◽  
Cu Film

scholarly journals Barrierless Cu–Ni–Nb thin films on silicon with high thermal stability and low electrical resistivity– ERRATUM

2014 ◽  
Vol 29 (4) ◽  
pp. 605-605 ◽  
Author(s):  
Xiao Na Li ◽  
Li Rong Zhao ◽  
Zhen Li ◽  
Li Jun Liu ◽  
Cui Min Bao ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Electrical Resistivity ◽  
High Thermal Stability

Fluorinated, Low Thermal Expansion Coefficient Polyimides For Interlayer Dielectric Application: Thermal Stability, Refractive Index And High Temperature Modulus Measurements

1995 ◽  
Vol 381 ◽  
Author(s):  
Brian C. Auman
Keyword(s):  
Thermal Stability ◽  
Refractive Index ◽  
Glass Transition ◽  
Moisture Absorption ◽  
Mechanical Analysis ◽  
Interlayer Dielectric ◽  
Low Thermal Expansion ◽  
Fluorinated Polyimides ◽  
Out Of Plane ◽  
Mechanical Modulus

AbstractThe mechanical, thermal, electrical and moisture absorption properties of rod-like, fluorinated polyimides and copolyimides developed in our laboratory are briefly reviewed. Further characterization work on the most promising candidates for interlayer dielectric applications is reported. This includes in- and out-of-plane refractive index measurements to estimate the isotropy of the dielectric constant, isothermal TGA measurements to assess thermal stability at processing temperatures and dynamic-mechanical analysis to ascertain the glass transition temperature and the mechanical modulus at temperatures in excess of the glass transition

Sign in / Sign up

Export Citation Format

Share Document