High thermal stability and low electrical resistivity carbon-containing Cu film on barrierless Si
2014 ◽
Vol 29
(4)
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pp. 605-605
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2008 ◽
Vol 44-46
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pp. 71-76
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2013 ◽
Vol 28
(24)
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pp. 3367-3373
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Keyword(s):
2021 ◽
Vol 112
(2)
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pp. 137-142
2005 ◽
Vol 148
(2)
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pp. 161-168
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2011 ◽
Vol 11
(5)
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pp. 4639-4643
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Keyword(s):