Fluorinated, Low Thermal Expansion Coefficient Polyimides For Interlayer Dielectric Application: Thermal Stability, Refractive Index And High Temperature Modulus Measurements

1995 ◽  
Vol 381 ◽  
Author(s):  
Brian C. Auman
Keyword(s):  
Thermal Stability ◽  
Refractive Index ◽  
Glass Transition ◽  
Moisture Absorption ◽  
Mechanical Analysis ◽  
Interlayer Dielectric ◽  
Low Thermal Expansion ◽  
Fluorinated Polyimides ◽  
Out Of Plane ◽  
Mechanical Modulus

AbstractThe mechanical, thermal, electrical and moisture absorption properties of rod-like, fluorinated polyimides and copolyimides developed in our laboratory are briefly reviewed. Further characterization work on the most promising candidates for interlayer dielectric applications is reported. This includes in- and out-of-plane refractive index measurements to estimate the isotropy of the dielectric constant, isothermal TGA measurements to assess thermal stability at processing temperatures and dynamic-mechanical analysis to ascertain the glass transition temperature and the mechanical modulus at temperatures in excess of the glass transition

Poly(Arylene Ethers) as Low Dielectric Constant Materials for ULSI Interconnect Applications

1996 ◽  
Vol 443 ◽  
Author(s):  
Raymond N. Vrtis ◽  
Kelly A. Heap ◽  
William F. Burgoyne ◽  
Lloyd M. Robeson
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Moisture Absorption ◽  
Dielectric Material ◽  
Mechanical Analysis ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Arylene Ether ◽  
Low Dielectric Constant Materials ◽  
Excellent Adhesion

AbstractPoly(arylene ethers)s are low dielectric constant organic spin on materials. PAE-2, which is a non-fluorinated poly(arylene ether), exhibits a dielectric constant below 3.0, thermal stability greater than 425 °C as well as excellent adhesion to Si, SiO2, and Al. These are the major atributes which makes it a very attractive candidate for integration as an interlevel or inter-metal dielectric material (ILD). Material properties including dielectric constant, thermal stability, moisture absorption, and mechanical analysis will be discussed.

Low-loss Polymer Optical Waveguides with High Thermal Stability

2001 ◽  
Vol 708 ◽  
Author(s):  
Jae-Wook Kang ◽  
Jae-Pil Kim ◽  
Won-Young Lee ◽  
Joon-Sung Kim ◽  
Jae-Suk Lee ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Refractive Index ◽  
Optical Waveguides ◽  
High Thermal Stability ◽  
Propagation Loss ◽  
Copolymer Composition ◽  
Infrared Communication ◽  
Arylene Ether ◽  
Fluorinated Polyimides ◽  
Channel Waveguides

ABSTRACTWe synthesized novel cross-linkable fluorinated copoly(arylene ether sulfide)s for optical waveguide applications, which have high thermal stability, high optical transparency in the infrared communication region, and much smaller birefringence than other thermally stable fluorinated polyimides. The refractive index of the material can be easily controlled from 1.515 to 1.587 by changing the copolymer composition in the materials. The birefringence of the cured polymers were 0.0031∼0.0039 at the wavelength of 1.55 μm. This is much lower than those of fluorinated polyimides for optical waveguides. The refractive index of fluorinated poly(arylene ether sulfide) (FPAESI) after being stored at 100 °C for 1000 hr remains almost constant demonstrating the thermal stability. The propagation loss of the channel waveguides fabricated using reactive ion etching was less than 0.4 dB/cm at the wavelength of 1.55 μm.

Performance properties of rigid polyurethane-polyisocyanurate/brewers’ spent grain foamed composites as function of isocyanate index

e-Polymers ◽  
2017 ◽  
Vol 17 (5) ◽  
pp. 427-437 ◽  
Author(s):  
Aleksander Hejna ◽  
Józef Haponiuk ◽  
Łukasz Piszczyk ◽  
Marek Klein ◽  
Krzysztof Formela
Keyword(s):  
Thermal Stability ◽  
Compressive Strength ◽  
Fourier Transform ◽  
Glass Transition ◽  
Crosslink Density ◽  
Mechanical Analysis ◽  
Ftir Analysis ◽  
Blowing Agent ◽  
Isocyanate Index ◽  
Spent Grain

AbstractIn the presented work, rigid polyurethane-polyisocyanurate (PUR-PIR) foams filled with brewers’ spent grain (BSG) were prepared. The influence of the isocyanate index (II) on its performance was investigated. Foams obtained with higher isocyanate index required a higher amount of hydrofluorocarbon physical blowing agent to provide the same apparent density of material. An increase of isocyanate index resulted in a slight decrease of cell size, which was related to the increased crosslink density due to enhanced generation of allophanate and biuret groups. Deterioration of compressive strength, from 226 to 202 kPa was observed with the rise of the isocyanate index. Dynamic mechanical analysis and swelling tests confirmed the increase of crosslink density with the increasing isocyanate index. The glass transition temperature rose from 165.7°C to 193.2°C. Fourier transform infrared (FTIR) analysis indicated an increase of the isocyanurate rings’ content in composites with a higher isocyanate index, causing noticeable enhancement of thermal stability. The onset of degradation was shifted from 196°C to 211°C.

Effect of Rubber Contents on Tribological and Thermomechanical Properties of Polybenzoxazine

2014 ◽  
Vol 576 ◽  
pp. 75-79 ◽  
Author(s):  
Chanchira Jubsilp ◽  
Sarawut Rimdusit ◽  
Tsutomu Takeichi
Keyword(s):  
Thermal Stability ◽  
Wear Resistance ◽  
Glass Transition ◽  
Mass Fraction ◽  
Mechanical Analysis ◽  
Thermomechanical Properties ◽  
Flexural Property ◽  
Test Machine ◽  
Thermal Stability Of ◽  
Ball On Disc

Bisphenol-A/aniline based polybenzoxazine (PBZ) modified with amine terminated butadiene–acrylonitrile (ATBN) were prepared. The tribological and thermomechanical properties as well as thermal stability of the PBZ/ATBN copolymers were investigated by ball-on-disc tribometer, dynamic mechanical analysis (DMA), universal test machine and thermogravimetric analysis (TGA). The inclusion of ATBN at a mass fraction of 5% was found to greatly increase friction coefficient and wear resistance of the copolymers. DMA measurements showed that the storage modulus and the glass transition temperature of the PBZ can be maintained with an addition of ATBN in the range of 1-5wt%. Moreover, flexural property measurements indicated that the flexural strength of the copolymer increased with increasing of ATBN content up to 10wt% whereas TGA results revealed that an increase of the PBZ content can help improve thermal stability of the copolymers.

Bottlebrush polymer-reinforced transparent multiphase plastics with enhanced thermal stability

2020 ◽  
Vol 56 (93) ◽  
pp. 14641-14644
Author(s):  
Yoshihiro Yamauchi ◽  
Sadaki Samitsu ◽  
Kenta Goto ◽  
Masayuki Takeuchi
Keyword(s):  
Thermal Stability ◽  
Refractive Index ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature

Bottlebrush polymers (BPs) are highly tunable with regard to their glass transition temperature, refractive index, and shape.

Investigating the role of GeO2 in enhancing the thermal stability and proton mobility of proton-conducting phosphate glasses

2021 ◽  
Author(s):  
Takahisa Omata ◽  
Aman Sharma ◽  
Takuya Kinoshita ◽  
Issei Suzuki ◽  
Tomohiro Ishiyama ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Phosphate Glasses ◽  
Proton Mobility ◽  
Proton Conducting

In this study, the effect of GeO2 on the thermal stability and proton mobility (μH) of proton-conducting phosphate glasses was experimentally investigated using 22HO1/2−3NaO1/2−(12−x)LaO3/2−xGeO2−63PO5/2 glasses. Increasing glass transition temperature (Tg)...

The effect of methyl and methoxy substituents on dianilines for a thermosetting polyimide system

2020 ◽  
Vol 32 (7) ◽  
pp. 801-822 ◽  
Author(s):  
John J La Scala ◽  
Greg Yandek ◽  
Jason Lamb ◽  
Craig M Paquette ◽  
William S Eck ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Molecular Weight ◽  
Glass Transition ◽  
Elevated Temperature ◽  
Methyl Substituent ◽  
Glass Transition Temperatures ◽  
High Performing ◽  
Methoxy Substituent ◽  
Acidic Conditions ◽  
Thermal Stability Of

4,4′-Methylenedianiline (MDA) is widely used in high-temperature polyimide resins, including polymerization of monomer reactants-15. The toxicity of MDA significantly limits the manufacturability using this resin. Modifying the substitution and electronics of MDA could allow for the reduction of toxicity while maintaining the high-performing properties of the materials derived from the modified MDA. The addition of a single methyl substituent, methoxy substituent, location of these substituents, and location of the amine relative to the phenolic bridge were modified as were other non-aniline diamines. Various anilines were condensed with paraformaldehyde under acidic conditions to yield dianilines. These dianilines and diamines were reacted with nadic anhydride and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride in methanol to form the polyamic acid oligomers and heated at elevated temperature to form polyimide oligomers. It was found that the molecular weight of the oligomers derived from MDA alternatives was generally lower than that of MDA oligomers resulting in lower glass transition temperatures ( T gs) and degradation temperatures. Additionally, methoxy substituents further reduce the T g of the polymers versus methyl substituents and reduce the thermal stability of the resin. Methyl-substituted alternatives produced polyimides with similar T gs and degradation temperatures. The toxicity of the MDA alternatives was examined. Although a few were identified with reduced toxicities, the alternatives with properties similar to that of MDA also had high toxicities.

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