Air-Stable Lithium Spheres Produced by Electrochemical Plating

2018 ◽  
Vol 130 (39) ◽  
pp. 12932-12935 ◽  
Author(s):  
Tingting Yang ◽  
Peng Jia ◽  
Qiunan Liu ◽  
Liqiang Zhang ◽  
Congcong Du ◽  
...  
Keyword(s):  
Electrochemical Plating

Studies about Electrochemical Plating with Zinc - nickel Alloys - the Influence of Deposition Potential on Stoichiometric Composition

2008 ◽  
Vol 59 (9) ◽  
Author(s):  
Violeta Vasilache ◽  
Gheorghe Gutt ◽  
Traian Vasilache
Keyword(s):  
Nickel Alloys ◽  
Stoichiometric Composition ◽  
Nickel Chloride ◽  
Deposition Potential ◽  
X Ray Diffraction ◽  
Pure Zinc ◽  
X Ray ◽  
Nickel Cobalt ◽  
Cobalt Iron ◽  
Electrochemical Plating

The electrochemical deposition of zinc and combinations with elements of the 8th group of the Periodic System (nickel, cobalt, iron) have good properties for anticorrosive protection, compared with pure zinc. For steel pieces, these films delay apparition and formation of white and red iron oxide. We used solutions with different concentrations of zinc chloride, nickel chloride and potassium chloride. To analyze the results we used the optic microscope and the X-ray diffraction.

Mechanistic understanding of electrochemical plating and stripping of metal electrodes

2019 ◽  
Vol 7 (9) ◽  
pp. 4668-4688 ◽  
Author(s):  
Deepti Tewari ◽  
Partha P. Mukherjee
Keyword(s):  
Metal Electrode ◽  
Metal Electrodes ◽  
Electrode Interface ◽  
Mechanistic Understanding ◽  
Electrochemical Plating

Mechanisms driving the evolution of the metal electrode interface during plating, stripping and formation of dead metal.

scholarly journals Analysis of Chemical Stability of Printing Pastes in Electrochemical Plating Solutions

2012 ◽  
Vol 27 ◽  
pp. 497-502 ◽  
Author(s):  
M.D. Wendling ◽  
A. Mondon ◽  
A. Kraft ◽  
J. Bartscha ◽  
M. Glatthaar ◽  
...  
Keyword(s):  
Chemical Stability ◽  
Electrochemical Plating

Electrochemical Preparation of Amorphous Feb Films Containing a large Quantity of Plastics

1996 ◽  
Vol 451 ◽  
Author(s):  
P. B. Lim ◽  
N. Fujita ◽  
P. T. Squire ◽  
M. Inoue ◽  
T. Fujii
Keyword(s):  
Amorphous Alloys ◽  
Composite Films ◽  
Surface States ◽  
Amorphous Structure ◽  
Coupling Coefficients ◽  
Electrochemical Preparation ◽  
Alloy Films ◽  
Preparation Conditions ◽  
Electrochemical Plating ◽  
Combined Technique

ABSTRACTAmorphous Fe80B20 alloy films with a large quantity of plastics (polymethyl methacrylate: PMMA) are prepared using a combined technique of electrochemical plating and spin coating. The embedding of amorphous alloys into PMMA plastics is expected to reduce the effective conductivities of alloy films, and hence to improve their magnetomechanical coupling coefficients at high frequency by reducing effective eddy-current losses. Preparation conditions for obtaining Fe100−XBX (X=20±5at%) films with amorphous structure are determined, and the composite films are formed in accordance with the plating conditions. The resultant composite films are studied by examining their surface states and magnetic properties.

Development of New Methods for Fine-Wiring in Si Using a Wet Catalytic Reaction

2011 ◽  
Vol 470 ◽  
pp. 129-134
Author(s):  
Chia Lung Lee ◽  
Tomohiko Sugita ◽  
Koji Tatsumi ◽  
Shigeru Ikeda ◽  
Michio Matsumura
Keyword(s):  
Catalytic Reaction ◽  
Wafer Surface ◽  
Wet Process ◽  
New Methods ◽  
Electrochemical Plating

Using a new wet process based on a catalytic reaction, pores and grooves were formed in Si using Au, Pt, or Ag as the catalyst. The diameter of the pore can be as small as 50 nm. However, to produce wiring in Si wafers, we primarily formed pores with a diameter of about 5 μm. These pores were filled with Cu by electrochemical plating, forming Cu wires developed to the wafer surface. In the process, the catalyst particles remaining at the bottom of the pore acted as seeds for the deposition of Cu and helped fill the pores without the formation of voids. In order to control the position of pores and grooves formed in Si, methods using catalytic electrodes were also developed.

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