Synthesis of Mesoporous Platinum-Palladium Alloy Films by Electrochemical Plating in Aqueous Surfactant Solutions

2012 ◽  
Vol 7 (9) ◽  
pp. 2133-2138 ◽  
Author(s):  
Hongjing Wang ◽  
Yusuke Yamauchi
Keyword(s):  
Palladium Alloy ◽  
Alloy Films ◽  
Surfactant Solutions ◽  
Mesoporous Platinum ◽  
Electrochemical Plating

Electrochemical Preparation of Amorphous Feb Films Containing a large Quantity of Plastics

1996 ◽  
Vol 451 ◽  
Author(s):  
P. B. Lim ◽  
N. Fujita ◽  
P. T. Squire ◽  
M. Inoue ◽  
T. Fujii
Keyword(s):  
Amorphous Alloys ◽  
Composite Films ◽  
Surface States ◽  
Amorphous Structure ◽  
Coupling Coefficients ◽  
Electrochemical Preparation ◽  
Alloy Films ◽  
Preparation Conditions ◽  
Electrochemical Plating ◽  
Combined Technique

ABSTRACTAmorphous Fe80B20 alloy films with a large quantity of plastics (polymethyl methacrylate: PMMA) are prepared using a combined technique of electrochemical plating and spin coating. The embedding of amorphous alloys into PMMA plastics is expected to reduce the effective conductivities of alloy films, and hence to improve their magnetomechanical coupling coefficients at high frequency by reducing effective eddy-current losses. Preparation conditions for obtaining Fe100−XBX (X=20±5at%) films with amorphous structure are determined, and the composite films are formed in accordance with the plating conditions. The resultant composite films are studied by examining their surface states and magnetic properties.

ChemInform Abstract: ETHYLENE HYDROGENATION OVER NICKEL-PALLADIUM ALLOY FILMS

1977 ◽  
Vol 8 (20) ◽  
pp. no-no
Author(s):  
R. L. MOSS ◽  
D. POPE ◽  
H. R. GIBBENS
Keyword(s):  
Palladium Alloy ◽  
Ethylene Hydrogenation ◽  
Alloy Films

Oxidation Resistance of Copper Alloy Thin Films Formed by Chemical Vapor Deposition

1996 ◽  
Vol 427 ◽  
Author(s):  
P. Atanasova ◽  
V. Bhaskaran ◽  
T. Kodas ◽  
M. Hampden-Smith
Keyword(s):  
Oxidation Resistance ◽  
Vapor Deposition ◽  
Copper Alloy ◽  
Pure Copper ◽  
Chemical Vapor ◽  
Palladium Alloy ◽  
Alloy Films ◽  
Resistance To Oxidation ◽  
Different Temperatures ◽  
High Purity Alloy

AbstractCo-deposition of copper-palladium alloy films was demonstrated using low-pressure CVD from individual precursors - (hexafluoroacetylacetonato)copper(I)(vinyltrimethylsilane) [(hfac)Cu(I)vtms] and palladium(II)bis(hexafluoroacetylacetonate) [Pd(hfac)2], for Cu and Pd respectively. High-purity alloy films with controlled composition, microstructure and morphology were prepared and their oxidation behavior was examined at different temperatures and compared with that of pure copper CVD films with similar morphology. As-deposited copper-palladium alloy films showed improved resistance to oxidation up to 300°C in air. Enhanced oxidation resistance compared to Cu CVD films was observed at concentrations of palladium as low as 0.5 at. %.

Arsenic Adsorption on Copper–Palladium Alloy Films

2014 ◽  
Vol 53 (18) ◽  
pp. 7821-7827 ◽  
Author(s):  
Karen J. Uffalussy ◽  
James B. Miller ◽  
Bret H. Howard ◽  
Dennis C. Stanko ◽  
Chunrong Yin ◽  
...  
Keyword(s):  
Palladium Alloy ◽  
Arsenic Adsorption ◽  
Alloy Films

Oxidation Resistance of Copper Alloy Thin Films Formed by Chemical Vapor Deposition

1996 ◽  
Vol 428 ◽  
Author(s):  
P. Atanasova ◽  
V. Bhaskaran ◽  
T. Kodas ◽  
M. Hampden-Smith
Keyword(s):  
Oxidation Resistance ◽  
Vapor Deposition ◽  
Copper Alloy ◽  
Pure Copper ◽  
Chemical Vapor ◽  
Palladium Alloy ◽  
Alloy Films ◽  
Resistance To Oxidation ◽  
Different Temperatures ◽  
High Purity Alloy

AbstractCo-deposition of copper-palladium alloy films was demonstrated using low-pressure CVD from individual precursors - (hexafluoroacetylacetonato)copper(I)(vinyltrimethylsilane) [(hfac)Cu(I)vtms] and palladium(II)bis(hexafluoroacetylacetonate) [Pd(hfac)2], for Cu and Pd respectively. High-purity alloy films with controlled composition, microstructure and morphology were prepared and their oxidation behavior was examined at different temperatures and compared with that of pure copper CVD films with similar morphology. As-deposited copper-palladium alloy films showed improved resistance to oxidation up to 300°C in air. Enhanced oxidation resistance compared to Cu CVD films was observed at concentrations of palladium as low as 0.5 at. %.

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