Assessment of Self-Assembled Monolayers as High-Performance Thermal Interface Materials

2017 ◽  
Vol 4 (15) ◽  
pp. 1700355 ◽  
Author(s):  
Yanlei Wang ◽  
Yu Cao ◽  
Ke Zhou ◽  
Zhiping Xu
Keyword(s):  
High Performance ◽  
Self Assembled Monolayers ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Assembled Monolayers ◽  
Self Assembled ◽  
Interface Materials

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Joseph R. Wasniewski ◽  
David H. Altman ◽  
Stephen L. Hodson ◽  
Timothy S. Fisher ◽  
Anuradha Bulusu ◽  
...  
Keyword(s):  
Steady State ◽  
High Performance ◽  
Applied Pressure ◽  
Test Facility ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermal Interface Resistance ◽  
Vertically Aligned ◽  
Performance Results ◽  
Interface Materials

The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured materials, such as carbon nanotubes (CNTs), are interesting due to their ability to provide low resistance heat transport from device-to-spreader and compliance between materials with dissimilar coefficients of thermal expansion (CTEs), but few application-ready configurations have been produced and tested. Recently, we have undertaken major efforts to develop functional nanothermal interface materials (nTIMs) based on short, vertically aligned CNTs grown on both sides of a thin interposer foil and interfaced with substrate materials via metallic bonding. A high-precision 1D steady-state test facility has been utilized to measure the performance of nTIM samples, and more importantly, to correlate performance to the controllable parameters. In this paper, we describe our material structures and the myriad permutations of parameters that have been investigated in their design. We report these nTIM thermal performance results, which include a best to-date thermal interface resistance measurement of 3.5 mm2 K/W, independent of applied pressure. This value is significantly better than a variety of commercially available, high-performance thermal pads and greases we tested, and compares favorably with the best results reported for CNT-based materials in an application-representative setting.

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

High-Performance Graphene Devices on SiO2/Si Substrate Modified by Highly Ordered Self-Assembled Monolayers

2011 ◽  
Vol 23 (21) ◽  
pp. 2464-2468 ◽  
Author(s):  
Xiaomu Wang ◽  
Jian-Bin Xu ◽  
Chengliang Wang ◽  
Jun Du ◽  
Weiguang Xie
Keyword(s):  
High Performance ◽  
Self Assembled Monolayers ◽  
Si Substrate ◽  
Assembled Monolayers ◽  
Self Assembled ◽  
Graphene Devices

Measurement of High-Performance Thermal Interfaces Using a Reduced Scale Steady-State Tester and Infrared Microscopy

2016 ◽  
Vol 138 (4) ◽  
Author(s):  
Andrew N. Smith ◽  
Nicholas R. Jankowski ◽  
Lauren M. Boteler
Keyword(s):  
Steady State ◽  
High Performance ◽  
Thermal Interface Materials ◽  
Interfacial Resistance ◽  
Heat Meter ◽  
Thermal Interface ◽  
Order Of Magnitude ◽  
Interface Materials ◽  
Reduced Scale ◽  
Magnitude Improvement

Thermal interface materials (TIMs) have reached values approaching the measurement uncertainty of standard ASTM D5470 based testers of approximately ±1 × 10−6 m2 K/W. This paper presents a miniature ASTM-type steady-state tester that was developed to address the resolution limits of standard testers by reducing the heat meter bar thickness and using infrared (IR) thermography to measure the temperature gradient along the heat meter bar. Thermal interfacial resistance measurements on the order of 1 × 10−6 m2 K/W with an order of magnitude improvement in the uncertainty of ±1 × 10−7 m2 K/W are demonstrated. These measurements were made on several TIMs with a thermal resistance as low as 1.14 × 10−6 m2 K/W.

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