scholarly journals Effect of water on critical and subcritical fracture properties of Woodford shale

2017 ◽  
Vol 122 (4) ◽  
pp. 2736-2750 ◽  
Author(s):  
Xiaofeng Chen ◽  
Peter Eichhubl ◽  
Jon E. Olson
Keyword(s):  
Woodford Shale ◽  
Fracture Properties ◽  
Effect Of Water ◽  
Subcritical Fracture

Effect of water shortage on six potato genotypes in the highlands of Bolivia (II): water relations, physiological parameters

Agronomie ◽  
2003 ◽  
Vol 23 (2) ◽  
pp. 181-190 ◽  
Author(s):  
Christophe Tourneux ◽  
Andr� Devaux ◽  
Maria Ren� Camacho ◽  
Pablo Mamani ◽  
Jean-Fran�ois Ledent
Keyword(s):  
Water Relations ◽  
Water Shortage ◽  
Physiological Parameters ◽  
Effect Of Water

EFFECT OF WATER CONTENT ON PROPERTIES OF Na2O, 3SiO2 GLASSES

1982 ◽  
Vol 43 (C9) ◽  
pp. C9-455-C9-458 ◽  
Author(s):  
M. Takata ◽  
M. Tomozawa ◽  
J. Acocella ◽  
J. Molinelli ◽  
C. Y. Erwin ◽  
...  
Keyword(s):  
Water Content ◽  
Effect Of Water

Effect of water and nutrient supply on the yield of pea varieties

2006 ◽  
Vol 34 (1) ◽  
pp. 569-572
Author(s):  
M. Lesznyák ◽  
Borbély Hunyadi
Keyword(s):  
Nutrient Supply ◽  
Effect Of Water

Micromechanics Measurements Applied to Integrated Circuit Microelectronics

1997 ◽  
Vol 473 ◽  
Author(s):  
David R. Clarke
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Fracture Resistance ◽  
Interface Fracture ◽  
New Techniques ◽  
Fracture Properties ◽  
Engineered Structures ◽  
Mechanical And Fracture Properties ◽  
Interconnect Lines ◽  
Metallic Interconnect

ABSTRACTAs in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.

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