[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Methodology for the thermal characterization of the MQUAD microelectronic package

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1993.225316 ◽

2002 ◽

Cited By ~ 8

Author(s):

B.M. Guenin ◽

D. Mahulikar

Keyword(s):

Thermal Characterization ◽

Microelectronic Package

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Thermal resistance, thermomechanical stress and thermal cycling endurance of silicon chips bonded with adhesives

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1993.225321 ◽

2002 ◽

Cited By ~ 7

Author(s):

A. Bjorneklett ◽

T. Tuhus ◽

L. Halbo ◽

H. Kristiansen

Keyword(s):

Thermal Resistance ◽

Thermal Cycling ◽

Thermomechanical Stress ◽

Silicon Chips

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Analysis and measurement of thermal resistance in a 3-dimensional silicon multichip module populated with assembly test chips

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1993.225337 ◽

2002 ◽

Cited By ~ 7

Author(s):

J.N. Sweet ◽

D.W. Peterson ◽

D. Chu ◽

B.L. Bainbridge ◽

R.A. Gassman ◽

...

Keyword(s):

Thermal Resistance ◽

Multichip Module ◽

3 Dimensional ◽

Test Chips

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Test chips, test systems and thermal test data for multichip modules in the ESPRIT-APACHIP project

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1993.225323 ◽

2002 ◽

Cited By ~ 1

Author(s):

S.C. O'Mathuna ◽

T. Fromont ◽

W. Koschnick ◽

L. O'Connor

Keyword(s):

Test Data ◽

Multichip Modules ◽

Test Systems ◽

Thermal Test ◽

Test Chips

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Thermal wake models for forced air cooling of electronic components

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1993.225330 ◽

2002 ◽

Cited By ~ 13

Author(s):

A. Ortega ◽

S. Ramanathan ◽

J.D. Chicci ◽

J.L. Prince

Keyword(s):

Air Cooling ◽

Electronic Components ◽

Forced Air ◽

Thermal Wake

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Heat transfer in evaporation in dielectric liquid films in different atmospheres using silicon testchips

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1993.225320 ◽

2002 ◽

Author(s):

H. Kristiansen ◽

A. Bjorneklett

Keyword(s):

Heat Transfer ◽

Liquid Films ◽

Dielectric Liquid

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Conjugate heat transfer from a raised isothermal heat source attached to a vertical board

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1993.225319 ◽

2002 ◽

Cited By ~ 4

Author(s):

J.R. Culham ◽

S. Lee ◽

M.M. Yovanovich

Keyword(s):

Heat Transfer ◽

Heat Source ◽

Conjugate Heat Transfer

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Heat transfer in a low aspect ratio horizontal enclosure for laptop computer application

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1993.225332 ◽

2002 ◽

Cited By ~ 10

Author(s):

A. Ortega ◽

B.S. Lall ◽

J. Chicci ◽

M. Aghazadeh ◽

B. Kiang

Keyword(s):

Heat Transfer ◽

Aspect Ratio ◽

Computer Application ◽

Laptop Computer ◽

Low Aspect Ratio

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Thermal component models for electro-thermal network simulations

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1993.225327 ◽

2002 ◽

Cited By ~ 32

Author(s):

A.R. Hefner ◽

D.L. Blackburn

Keyword(s):

Thermal Component ◽

Thermal Network ◽

Network Simulations ◽

Component Models

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Thermal performance limits of the QFP family

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1993.225317 ◽

2002 ◽

Cited By ~ 8

Author(s):

S. Mulgaonker ◽

B. Chambers ◽

M. Mahalingam ◽

G. Ganesan ◽

V. Hause ◽

...

Keyword(s):

Thermal Performance ◽

Performance Limits

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[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Methodology for the thermal characterization of the MQUAD microelectronic package

Thermal resistance, thermomechanical stress and thermal cycling endurance of silicon chips bonded with adhesives

Analysis and measurement of thermal resistance in a 3-dimensional silicon multichip module populated with assembly test chips

Test chips, test systems and thermal test data for multichip modules in the ESPRIT-APACHIP project

Thermal wake models for forced air cooling of electronic components

Heat transfer in evaporation in dielectric liquid films in different atmospheres using silicon testchips

Conjugate heat transfer from a raised isothermal heat source attached to a vertical board

Heat transfer in a low aspect ratio horizontal enclosure for laptop computer application

Thermal component models for electro-thermal network simulations

Thermal performance limits of the QFP family

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[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Methodology for the thermal characterization of the MQUAD microelectronic package

Thermal resistance, thermomechanical stress and thermal cycling endurance of silicon chips bonded with adhesives

Analysis and measurement of thermal resistance in a 3-dimensional silicon multichip module populated with assembly test chips

Test chips, test systems and thermal test data for multichip modules in the ESPRIT-APACHIP project

Thermal wake models for forced air cooling of electronic components

Heat transfer in evaporation in dielectric liquid films in different atmospheres using silicon testchips

Conjugate heat transfer from a raised isothermal heat source attached to a vertical board

Heat transfer in a low aspect ratio horizontal enclosure for laptop computer application

Thermal component models for electro-thermal network simulations

Thermal performance limits of the QFP family

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Latest Publications