2008 2nd Electronics Systemintegration Technology Conference
Latest Publications

TOTAL DOCUMENTS

261

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424428137

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Contents list

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684565 ◽

2008 ◽

Download Full-text

A simulation module for supporting the manufacture of high value added electronics manufacturing

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684376 ◽

2008 ◽

Cited By ~ 1

Author(s):

L.A.M. Quintero ◽

A.A. West ◽

D.M. Segura Velandia ◽

P.P. Conway ◽

D.C. Whalley ◽

...

Keyword(s):

Value Added ◽

Electronics Manufacturing

Download Full-text

The effect of surface modification on adhesion of polymer waveguide on flexible substrate

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684483 ◽

2008 ◽

Author(s):

Tze Yang Hin ◽

Changqing Liu ◽

P.P. Conway

Keyword(s):

Surface Modification ◽

Flexible Substrate ◽

Polymer Waveguide ◽

Effect Of Surface

Download Full-text

The conceptual design of products benefiting from integrated micro-features

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684544 ◽

2008 ◽

Author(s):

David Topham ◽

David Harrison

Keyword(s):

Conceptual Design ◽

Micro Features

Download Full-text

Modelling and simulation of simple mechatronic system - position control solution based on linear variable inductor displacement transducer

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684354 ◽

2008 ◽

Cited By ~ 1

Author(s):

A. Drumea ◽

A. Vasile ◽

P. Svasta ◽

I. Ilie

Keyword(s):

Position Control ◽

Displacement Transducer ◽

Modelling And Simulation ◽

Mechatronic System ◽

Control Solution ◽

Variable Inductor

Download Full-text

Mayoral foreword

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684567 ◽

2008 ◽

Download Full-text

Investigation of the moisture impact on the stacked die package

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684519 ◽

2008 ◽

Cited By ~ 1

Author(s):

C.Y. Li ◽

Z.K. Hua ◽

Y.X. Luo ◽

L.Q. Cao ◽

J.H. Zhang

Download Full-text

Surface evolution and bonding properties of electroplated Au/Sn/Au

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684511 ◽

2008 ◽

Cited By ~ 8

Author(s):

K. Wang ◽

K. Aasmundtveit ◽

H. Jakobsen

Keyword(s):

Surface Evolution ◽

Bonding Properties

Download Full-text

Computer modelling analysis of the globtop’s effects on aluminium wirebond reliability

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684555 ◽

2008 ◽

Cited By ~ 2

Author(s):

Hua Lu ◽

Wei-Sun Loh ◽

C. Bailey ◽

C.M. Johnson

Keyword(s):

Computer Modelling ◽

Modelling Analysis

Download Full-text

Sonochemistry — a sound approach to surface modification

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684433 ◽

2008 ◽

Author(s):

A. Cobley ◽

T. Mason

Keyword(s):

Surface Modification

Download Full-text

2008 2nd Electronics Systemintegration Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Contents list

A simulation module for supporting the manufacture of high value added electronics manufacturing

The effect of surface modification on adhesion of polymer waveguide on flexible substrate

The conceptual design of products benefiting from integrated micro-features

Modelling and simulation of simple mechatronic system - position control solution based on linear variable inductor displacement transducer

Mayoral foreword

Investigation of the moisture impact on the stacked die package

Surface evolution and bonding properties of electroplated Au/Sn/Au

Computer modelling analysis of the globtop’s effects on aluminium wirebond reliability

Sonochemistry — a sound approach to surface modification

2008 2nd Electronics Systemintegration Technology Conference
Latest Publications