Electrical Modeling and Design for 3D System Integration
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Published By John Wiley & Sons, Inc.

9781118166727, 9780470623466

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Introduction

Electrical Modeling and Design for 3D System Integration ◽

10.1002/9781118166727.ch1 ◽

2012 ◽

pp. 1-15

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Index

Electrical Modeling and Design for 3D System Integration ◽

10.1002/9781118166727.index ◽

2012 ◽

pp. 361-366

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Hybrid Integral Equation Modeling Methods for 3D Integration

Electrical Modeling and Design for 3D System Integration ◽

10.1002/9781118166727.ch4 ◽

2012 ◽

pp. 185-240

Keyword(s):

Integral Equation ◽

Equation Modeling ◽

3D Integration ◽

Modeling Methods ◽

Hybrid Integral

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Front Matter

Electrical Modeling and Design for 3D System Integration ◽

10.1002/9781118166727.fmatter ◽

2012 ◽

pp. i-xiv

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Supplemental Images

Electrical Modeling and Design for 3D System Integration ◽

10.1002/9781118166727.ins ◽

2012 ◽

pp. c1-c8

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2.5D Simulation Method for 3D Integrated Systems

Electrical Modeling and Design for 3D System Integration ◽

10.1002/9781118166727.ch3 ◽

2012 ◽

pp. 97-184

Keyword(s):

Simulation Method ◽

Integrated Systems

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Systematic Microwave Network Analysis for 3D Integrated Systems

Electrical Modeling and Design for 3D System Integration ◽

10.1002/9781118166727.ch5 ◽

2012 ◽

pp. 241-330

Keyword(s):

Network Analysis ◽

Integrated Systems ◽

Microwave Network Analysis

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Modeling of Through-Silicon Vias (TSV) in 3D Integration

Electrical Modeling and Design for 3D System Integration ◽

10.1002/9781118166727.ch6 ◽

2012 ◽

pp. 331-360 ◽

Cited By ~ 1

Keyword(s):

3D Integration ◽

Through Silicon Vias ◽

Silicon Vias

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Macromodeling of Complex Interconnects in 3D Integration

Electrical Modeling and Design for 3D System Integration ◽

10.1002/9781118166727.ch2 ◽

2012 ◽

pp. 16-96

Keyword(s):

3D Integration

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