2010 International Symposium on Advanced Packaging Materials: Microtech (APM)
Latest Publications

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Published By IEEE

9781424467563

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Computational modelling of electrical field intensity for high voltage semiconductor package design

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441380 ◽

2010 ◽

Cited By ~ 2

Author(s):

N. S. Nobeen ◽

D. C. Whalley ◽

D. A. Hutt ◽

B. Haworth

Keyword(s):

Field Intensity ◽

High Voltage ◽

Computational Modelling ◽

Electrical Field ◽

Package Design ◽

Electrical Field Intensity

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Optimization of stiffness for isotropic conductive adhesives

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441385 ◽

2010 ◽

Cited By ~ 2

Author(s):

Chune Fu ◽

Si Chen ◽

Par Berggren ◽

Qiong Fan ◽

Wenhui Du ◽

...

Keyword(s):

Conductive Adhesives ◽

Isotropic Conductive Adhesives

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Capacitive sensor for automotive engine oil degradation using wireless network

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441375 ◽

2010 ◽

Cited By ~ 1

Author(s):

Jaedong Cho ◽

Sekwang Park

Keyword(s):

Wireless Network ◽

Capacitive Sensor ◽

Engine Oil ◽

Oil Degradation ◽

Automotive Engine

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Graphite nanoplatelet/silicone composites for thermal interface applications

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441382 ◽

2010 ◽

Cited By ~ 7

Author(s):

M.A. Raza ◽

A.V.K. Westwood ◽

C. Stirling

Keyword(s):

Thermal Interface

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Single sided substrates and packages based on laminate materials

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441386 ◽

2010 ◽

Cited By ~ 3

Author(s):

Bernd K. Appelt ◽

Bruce Su ◽

Alex S.F. Huang ◽

Tony Hsieh ◽

Yi-Shao Lai

Keyword(s):

Laminate Materials

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Nano- und micro sized filler particles for improved humidity resistance of encapsulants

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441384 ◽

2010 ◽

Cited By ~ 2

Author(s):

T. Braun ◽

J. Bauer ◽

L. Georgi ◽

K.-F. Becker ◽

M. Koch ◽

...

Keyword(s):

Humidity Resistance ◽

Filler Particles

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A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441383 ◽

2010 ◽

Author(s):

Huaxiang Lai ◽

Xiuzhen Lu ◽

Si Chen ◽

Chune Fu ◽

Johan Liu

Keyword(s):

Conductive Adhesive ◽

Sic Nanoparticles ◽

Isotropic Conductive Adhesive

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Optical fibre array manufacture using electrostatic actuation

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441376 ◽

2010 ◽

Author(s):

Dominik Weiland ◽

Markus Luetzelschwab ◽

Eitan Abraham ◽

Marc P.Y. Desmulliez ◽

Peter Molter ◽

...

Keyword(s):

Optical Fibre ◽

Electrostatic Actuation

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Packaging of LED backlights for ruggedised displays

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441377 ◽

2010 ◽

Author(s):

C Bailey ◽

Y Lee ◽

H Lu ◽

N Strusevich ◽

C Yin

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Bespoke interconnect technologies for optoelectronic and biomedical products

2010 International Symposium on Advanced Packaging Materials: Microtech (APM) ◽

10.1109/isapm.2010.5441388 ◽

2010 ◽

Author(s):

Marc P.Y. Desmulliez ◽

David Flynn

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2010 International Symposium on Advanced Packaging Materials: Microtech (APM)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Computational modelling of electrical field intensity for high voltage semiconductor package design

Optimization of stiffness for isotropic conductive adhesives

Capacitive sensor for automotive engine oil degradation using wireless network

Graphite nanoplatelet/silicone composites for thermal interface applications

Single sided substrates and packages based on laminate materials

Nano- und micro sized filler particles for improved humidity resistance of encapsulants

A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

Optical fibre array manufacture using electrostatic actuation

Packaging of LED backlights for ruggedised displays

Bespoke interconnect technologies for optoelectronic and biomedical products

2010 International Symposium on Advanced Packaging Materials: Microtech (APM)
Latest Publications