Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)
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Temperature sensors placement strategy for fault diagnosis in integrated circuits

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915185 ◽

2002 ◽

Cited By ~ 5

Author(s):

P. Bratek ◽

A. Kos

Keyword(s):

Fault Diagnosis ◽

Integrated Circuits ◽

Temperature Sensors

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The study of micro-fin heat sinks for electronic cooling applications

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915181 ◽

2002 ◽

Cited By ~ 3

Author(s):

Heng-Chieh Chien ◽

Ming-Hsi Tseng ◽

Chih-Yao Wang ◽

Chu Chun-Hsun

Keyword(s):

Electronic Cooling ◽

Heat Sinks

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Thermal design of a desktop computer system using CFD analysis

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915139 ◽

2002 ◽

Cited By ~ 7

Author(s):

C.-W. Yu ◽

R.L. Webb

Keyword(s):

Computer System ◽

Thermal Design ◽

Cfd Analysis ◽

Desktop Computer

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Effect of flag design on thermal performance of PBGA packages

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915182 ◽

2002 ◽

Cited By ~ 1

Author(s):

B. Joiner

Keyword(s):

Thermal Performance

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A generic method for thermal multiport model generation of IC packages

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915164 ◽

2002 ◽

Cited By ~ 6

Author(s):

M. Rencz ◽

V. Szekely

Keyword(s):

Model Generation

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Thermal-mechanical measurements and analysis of an advanced thermal interface material construction

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915147 ◽

2002 ◽

Author(s):

F. Raiszadeh ◽

E. Derian

Keyword(s):

Thermal Interface Material ◽

Thermal Interface ◽

Mechanical Measurements

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Optimization of thermal resistance in quasi monolithic integration technology (QMIT) structure

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915136 ◽

2002 ◽

Cited By ~ 3

Author(s):

M. Joodaki ◽

G. Kompa ◽

H. Hillmer ◽

R. Kassing

Keyword(s):

Thermal Resistance ◽

Monolithic Integration ◽

Integration Technology

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A high-speed thermal imaging system for semiconductor device analysis

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915143 ◽

2002 ◽

Cited By ~ 7

Author(s):

A. Hefner ◽

D. Berning ◽

D. Blackburn ◽

C. Chapuy ◽

S. Bouche

Keyword(s):

Thermal Imaging ◽

High Speed ◽

Semiconductor Device ◽

Imaging System ◽

Thermal Imaging System

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The development of a natural graphite heat-spreader

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915157 ◽

2002 ◽

Cited By ~ 9

Author(s):

J. Norley ◽

J.J.-W. Tzeng ◽

G. Getz ◽

J. Klug ◽

B. Fedor

Keyword(s):

Natural Graphite ◽

Heat Spreader ◽

Graphite Heat

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Thermal analysis of power cycling effects on high power IGBT modules by the boundary element method

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915141 ◽

2002 ◽

Cited By ~ 10

Author(s):

Z. Khatir ◽

S. Lefebvre

Keyword(s):

Thermal Analysis ◽

Boundary Element Method ◽

Boundary Element ◽

High Power ◽

Igbt Modules ◽

Power Cycling ◽

Element Method

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Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Temperature sensors placement strategy for fault diagnosis in integrated circuits

The study of micro-fin heat sinks for electronic cooling applications

Thermal design of a desktop computer system using CFD analysis

Effect of flag design on thermal performance of PBGA packages

A generic method for thermal multiport model generation of IC packages

Thermal-mechanical measurements and analysis of an advanced thermal interface material construction

Optimization of thermal resistance in quasi monolithic integration technology (QMIT) structure

A high-speed thermal imaging system for semiconductor device analysis

The development of a natural graphite heat-spreader

Thermal analysis of power cycling effects on high power IGBT modules by the boundary element method

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)
Latest Publications