Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications
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Published By Springer Berlin Heidelberg

9783642632211, 9783642559082

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Materials Issues and Characterization of Low-k Dielectric Materials

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications ◽

10.1007/978-3-642-55908-2_2 ◽

2003 ◽

pp. 23-74 ◽

Cited By ~ 1

Author(s):

E. T. Ryan ◽

A. J. McKerrow ◽

J. Leu ◽

P. S. Ho

Keyword(s):

Dielectric Materials ◽

Low K

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Integration of SiLK Semiconductor Dielectric

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications ◽

10.1007/978-3-642-55908-2_10 ◽

2003 ◽

pp. 277-304 ◽

Cited By ~ 1

Author(s):

Joost J. Waeterloos

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Diffusion Of Metals In Polymers And During Metal/Polymer Interface Formation

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications ◽

10.1007/978-3-642-55908-2_8 ◽

2003 ◽

pp. 221-251 ◽

Cited By ~ 7

Author(s):

F. Faupel ◽

A. Thran ◽

M. Kiene ◽

T. Strunskus ◽

V. Zaporojtchenko ◽

...

Keyword(s):

Interface Formation ◽

Polymer Interface ◽

Metal Polymer

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Overview on Low Dielectric Constant Materials for IC Applications

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications ◽

10.1007/978-3-642-55908-2_1 ◽

2003 ◽

pp. 1-21 ◽

Cited By ~ 11

Author(s):

P. S. Ho ◽

J. Leu ◽

W. W. Lee

Keyword(s):

Dielectric Constant ◽

Low Dielectric Constant ◽

Low Dielectric ◽

Low Dielectric Constant Materials

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Plasma Etching of Low Dielectric Constant Materials

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications ◽

10.1007/978-3-642-55908-2_9 ◽

2003 ◽

pp. 253-276

Author(s):

G. S. Oehrlein ◽

T. E. F. M. Standaert ◽

P. J. Matsuo

Keyword(s):

Dielectric Constant ◽

Plasma Etching ◽

Low Dielectric Constant ◽

Low Dielectric ◽

Low Dielectric Constant Materials

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Plasma-Enhanced Chemical Vapor Deposition of FSG and a-C:F Low-k Materials

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications ◽

10.1007/978-3-642-55908-2_5 ◽

2003 ◽

pp. 121-166

Author(s):

K. Endo ◽

K. Kishimoto ◽

Y. Matsubara ◽

K. Koyanagi

Keyword(s):

Chemical Vapor Deposition ◽

Vapor Deposition ◽

Chemical Vapor ◽

Low K

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Vapor Deposition of Low-k Polymeric Dielectrics

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications ◽

10.1007/978-3-642-55908-2_4 ◽

2003 ◽

pp. 95-119 ◽

Cited By ~ 3

Author(s):

W. N. Gill ◽

S. Rogojevic ◽

T. Lu

Keyword(s):

Vapor Deposition ◽

Polymeric Dielectrics ◽

Low K

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Metal/Polymer Interfacial Interactions

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications ◽

10.1007/978-3-642-55908-2_7 ◽

2003 ◽

pp. 203-220

Author(s):

D. M. Martini ◽

J. A. Kelber

Keyword(s):

Interfacial Interactions ◽

Metal Polymer

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Porous Organosilicates for On-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications ◽

10.1007/978-3-642-55908-2_6 ◽

2003 ◽

pp. 167-202 ◽

Cited By ~ 3

Author(s):

W. Volksen ◽

C. J. Hawker ◽

J. L. Hedrick ◽

V. Lee ◽

T. Magbitang ◽

...

Keyword(s):

On Chip

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Structure and Property Characterization of Low-k Dielectric Porous Thin Films Determined by X-Ray Reflectivity and Small-Angle Neutron Scattering

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications ◽

10.1007/978-3-642-55908-2_3 ◽

2003 ◽

pp. 75-93 ◽

Cited By ~ 1

Author(s):

E. K. Lin ◽

H. Lee ◽

B. J. Bauer ◽

H. Wang ◽

J. T. Wetzel ◽

...

Keyword(s):

Thin Films ◽

Neutron Scattering ◽

Small Angle ◽

Small Angle Neutron Scattering ◽

X Ray ◽

Structure And Property ◽

Porous Thin Films ◽

Property Characterization ◽

Low K

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Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC ApplicationsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer Berlin Heidelberg

Materials Issues and Characterization of Low-k Dielectric Materials

Integration of SiLK Semiconductor Dielectric

Diffusion Of Metals In Polymers And During Metal/Polymer Interface Formation

Overview on Low Dielectric Constant Materials for IC Applications

Plasma Etching of Low Dielectric Constant Materials

Plasma-Enhanced Chemical Vapor Deposition of FSG and a-C:F Low-k Materials

Vapor Deposition of Low-k Polymeric Dielectrics

Metal/Polymer Interfacial Interactions

Porous Organosilicates for On-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity

Structure and Property Characterization of Low-k Dielectric Porous Thin Films Determined by X-Ray Reflectivity and Small-Angle Neutron Scattering

Springer Series in Advanced Microelectronics - Low Dielectric Constant Materials for IC Applications
Latest Publications