Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology
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Published By Springer US

9780792376767, 9781461502319

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Multi-Chip Carriers in a System-on-a Chip-World

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology ◽

10.1007/978-1-4615-0231-9_2 ◽

2003 ◽

pp. 15-47

Author(s):

Evan Davidson

Keyword(s):

System On A Chip

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Recent Advancements in Flex Circuit Technology Using Liquid Crystal Polymer Substrates

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology ◽

10.1007/978-1-4615-0231-9_11 ◽

2003 ◽

pp. 257-287 ◽

Cited By ~ 2

Author(s):

Rui Yang ◽

Terry F. Hayden

Keyword(s):

Liquid Crystal ◽

Liquid Crystal Polymer ◽

Polymer Substrates ◽

Crystal Polymer ◽

Circuit Technology

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Availability of High Density Interconnect Flexible Circuits

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology ◽

10.1007/978-1-4615-0231-9_10 ◽

2003 ◽

pp. 247-255

Author(s):

E. Jan Vardaman ◽

Dominique Numakura

Keyword(s):

High Density

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Thin Chips for Flexible and 3D-Integrated Electronic Systems

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology ◽

10.1007/978-1-4615-0231-9_5 ◽

2003 ◽

pp. 101-148 ◽

Cited By ~ 2

Author(s):

Karlheinz Bock ◽

Michael Feil ◽

Christof Landesberger

Keyword(s):

Electronic Systems

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Conclusion

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology ◽

10.1007/978-1-4615-0231-9_14 ◽

2003 ◽

pp. 327-328

Author(s):

John W. Balde

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Flex and the Interconnected Mesh Power System (IMPS)

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology ◽

10.1007/978-1-4615-0231-9_12 ◽

2003 ◽

pp. 289-309 ◽

Cited By ~ 2

Author(s):

Leonard W. Schaper

Keyword(s):

Power System

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Flexible, Microarray Interconnection Technique Applied to Biomedical Microdevices

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology ◽

10.1007/978-1-4615-0231-9_6 ◽

2003 ◽

pp. 149-176

Author(s):

Joerg-Uwe Meyer ◽

Martin Schuettler ◽

Oliver Scholz ◽

Werner Haberer ◽

Thomas Stieglitz

Keyword(s):

Biomedical Microdevices

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Valtronic CSP3D

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology ◽

10.1007/978-1-4615-0231-9_8 ◽

2003 ◽

pp. 217-234

Author(s):

Georges Rochat ◽

Philippe Clot ◽

Jean-François Zeberli

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Folded Flex and other Structures for System-in-a-Package

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology ◽

10.1007/978-1-4615-0231-9_7 ◽

2003 ◽

pp. 177-216

Author(s):

Mike Warner ◽

William Carlson

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Packaging Technologies for Flexible Systems

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology ◽

10.1007/978-1-4615-0231-9_3 ◽

2003 ◽

pp. 49-67 ◽

Cited By ~ 3

Author(s):

Christine Kallmayer

Keyword(s):

Flexible Systems

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Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging TechnologyLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer US

Multi-Chip Carriers in a System-on-a Chip-World

Recent Advancements in Flex Circuit Technology Using Liquid Crystal Polymer Substrates

Availability of High Density Interconnect Flexible Circuits

Thin Chips for Flexible and 3D-Integrated Electronic Systems

Conclusion

Flex and the Interconnected Mesh Power System (IMPS)

Flexible, Microarray Interconnection Technique Applied to Biomedical Microdevices

Valtronic CSP3D

Folded Flex and other Structures for System-in-a-Package

Packaging Technologies for Flexible Systems

Emerging Technology in Advanced Packaging Series - Foldable Flex and Thinned Silicon Multichip Packaging Technology
Latest Publications