Engineering Materials and Processes - PCM-Enhanced Building Components
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Published By Springer International Publishing

9783319142852, 9783319142869

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Basic Building Envelope Products Containing PCM and Related Patents

Engineering Materials and Processes - PCM-Enhanced Building Components ◽

10.1007/978-3-319-14286-9_7 ◽

2015 ◽

pp. 235-271

Author(s):

Jan Kośny

Keyword(s):

Building Envelope

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Overview of Basic Solid–Liquid PCMs Used in Building Envelopes—Packaging Methods, Encapsulation, and Thermal Enhancement

Engineering Materials and Processes - PCM-Enhanced Building Components ◽

10.1007/978-3-319-14286-9_3 ◽

2015 ◽

pp. 61-105 ◽

Cited By ~ 2

Author(s):

Jan Kośny

Keyword(s):

Building Envelopes ◽

Thermal Enhancement ◽

Solid Liquid

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Short History of PCM Applications in Building Envelopes

Engineering Materials and Processes - PCM-Enhanced Building Components ◽

10.1007/978-3-319-14286-9_2 ◽

2015 ◽

pp. 21-59 ◽

Cited By ~ 4

Author(s):

Jan Kośny

Keyword(s):

Short History ◽

Building Envelopes ◽

History Of

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Thermal and Energy Modeling of PCM-Enhanced Building Envelopes

Engineering Materials and Processes - PCM-Enhanced Building Components ◽

10.1007/978-3-319-14286-9_6 ◽

2015 ◽

pp. 167-234 ◽

Cited By ~ 1

Author(s):

Jan Kośny

Keyword(s):

Energy Modeling ◽

Building Envelopes

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Introduction

Engineering Materials and Processes - PCM-Enhanced Building Components ◽

10.1007/978-3-319-14286-9_1 ◽

2015 ◽

pp. 1-19

Author(s):

Jan Kośny

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Examples of Full-Scale Field Experiments—Test Huts and Whole Buildings Containing PCM-Enhanced Building Envelope Components

Engineering Materials and Processes - PCM-Enhanced Building Components ◽

10.1007/978-3-319-14286-9_5 ◽

2015 ◽

pp. 143-166 ◽

Cited By ~ 1

Author(s):

Jan Kośny

Keyword(s):

Field Experiments ◽

Building Envelope ◽

Full Scale ◽

Scale Field

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Laboratory Thermal Testing of PCM-Enhanced Building Products and Envelope Systems

Engineering Materials and Processes - PCM-Enhanced Building Components ◽

10.1007/978-3-319-14286-9_4 ◽

2015 ◽

pp. 107-141

Author(s):

Jan Kośny

Keyword(s):

Thermal Testing ◽

Building Products

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Engineering Materials and Processes - PCM-Enhanced Building ComponentsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer International Publishing

Basic Building Envelope Products Containing PCM and Related Patents

Overview of Basic Solid–Liquid PCMs Used in Building Envelopes—Packaging Methods, Encapsulation, and Thermal Enhancement

Short History of PCM Applications in Building Envelopes

Thermal and Energy Modeling of PCM-Enhanced Building Envelopes

Introduction

Examples of Full-Scale Field Experiments—Test Huts and Whole Buildings Containing PCM-Enhanced Building Envelope Components

Laboratory Thermal Testing of PCM-Enhanced Building Products and Envelope Systems

Engineering Materials and Processes - PCM-Enhanced Building Components
Latest Publications