Electrical Performance of Electronic Packaging
Latest Publications

TOTAL DOCUMENTS

69

(FIVE YEARS 0)

H-INDEX

6

(FIVE YEARS 0)

Published By IEEE

0780335147

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A general-purpose SPICE model for multiconductor transmission lines

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1996.564816 ◽

2002 ◽

Author(s):

M. Celik ◽

A.C. Cangellaris

Keyword(s):

Transmission Lines ◽

General Purpose ◽

Multiconductor Transmission Lines ◽

Spice Model

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Attenuation in ribbon microstrip with and without dielectric cover

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1996.564794 ◽

2002 ◽

Author(s):

K.K. Joshi ◽

R.D. Pollard ◽

V. Postoyalko

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Computer design strategy for MCM-D/flip-chip technology

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1996.564758 ◽

2002 ◽

Author(s):

P.D. Franzon ◽

T. Conte ◽

S. Banerjia ◽

A. Glaser ◽

S. Lipa ◽

...

Keyword(s):

Flip Chip ◽

Design Strategy ◽

Computer Design ◽

Chip Technology

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Performance of 3-D microwave package for X-band radar

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1996.564834 ◽

2002 ◽

Author(s):

J.J. Wooldridge

Keyword(s):

X Band

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Transient analysis of single interconnects characterized with measured S-parameter data

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1996.564817 ◽

2002 ◽

Cited By ~ 1

Author(s):

J.S.-H. Wang ◽

W.W.-M. Dai

Keyword(s):

Transient Analysis ◽

S Parameter

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Selective oxidized porous silicon (SOPS) substrate for microwave power chip-packaging

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1996.564831 ◽

2002 ◽

Cited By ~ 2

Author(s):

Choong-Mo Nam ◽

Young-Se Kwon

Keyword(s):

Porous Silicon ◽

Microwave Power ◽

Oxidized Porous Silicon

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Time domain modeling of high-speed circuit structures with TLM

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1996.564828 ◽

2002 ◽

Cited By ~ 1

Author(s):

W.J.R. Hoefer

Keyword(s):

Time Domain ◽

High Speed ◽

Domain Modeling ◽

Time Domain Modeling

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Analysis of crosstalk in packaged microwave circuits

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1996.564827 ◽

2002 ◽

Author(s):

Chien-Nan Kuo ◽

B. Houshmand ◽

T. Itoh

Keyword(s):

Microwave Circuits

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Modeling ground plane cuts using transmission line theory

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1996.564840 ◽

2002 ◽

Cited By ~ 1

Author(s):

E. Tuncer ◽

Cheung-Wei Lain ◽

F.Y. Yuan

Keyword(s):

Transmission Line ◽

Ground Plane ◽

Transmission Line Theory ◽

Line Theory

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Dispersion model for suspended microstrip line

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1996.564776 ◽

2002 ◽

Author(s):

A.K. Verma ◽

R. Kumar

Keyword(s):

Microstrip Line ◽

Dispersion Model ◽

Suspended Microstrip Line

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