Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium

Thermal management of an led light engine for airborne applications

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ◽

10.1109/stherm.2006.1625225 ◽

2006 ◽

Cited By ~ 7

Author(s):

R. Wilcoxon ◽

D. Cornelius

Keyword(s):

Thermal Management ◽

Led Light ◽

Light Engine

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Optimization of microchannel heat sinks using entropy generation minimization method

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ◽

10.1109/stherm.2006.1625210 ◽

2006 ◽

Cited By ~ 21

Author(s):

W.A. Khan ◽

M.M. Yovanovich ◽

J.R. Culham

Keyword(s):

Entropy Generation ◽

Heat Sinks ◽

Minimization Method ◽

Entropy Generation Minimization ◽

Microchannel Heat Sinks

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Fundamentals of a floating loop concept based on R134a refrigerant cooling of high heat flux electronics

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ◽

10.1109/stherm.2006.1625207 ◽

2006 ◽

Cited By ~ 4

Author(s):

C.W. Ayers ◽

J.S. Hsu ◽

K.T. Lowe

Keyword(s):

Heat Flux ◽

High Heat ◽

High Heat Flux

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Optimized thermo-reflectance system for measuring the thermal properties of thin-films and their interfaces

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ◽

10.1109/stherm.2006.1625211 ◽

2006 ◽

Cited By ~ 6

Author(s):

M.G. Burzo ◽

P.L. Komarov ◽

P.E. Raad

Keyword(s):

Thin Films ◽

Thermal Properties

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Diamond pins utilized as thermal vias for high heat flux spreading in CTE-compatible lids and substrates for semiconductor packaging

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ◽

10.1109/stherm.2006.1625223 ◽

2006 ◽

Cited By ~ 2

Author(s):

D.L. Saums ◽

B. Edward ◽

P. Ruzicka ◽

K. Fennessy ◽

R. Hay ◽

...

Keyword(s):

Heat Flux ◽

High Heat ◽

High Heat Flux ◽

Semiconductor Packaging

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Optimization of doping concentration for three-dimensional bulk silicon microrefrigerators

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ◽

10.1109/stherm.2006.1625234 ◽

2006 ◽

Cited By ~ 1

Author(s):

Yan Zhang ◽

Gehong Zeng ◽

A. Shakouri ◽

Peng Wang ◽

Bao Yang ◽

...

Keyword(s):

Doping Concentration ◽

Three Dimensional ◽

Bulk Silicon

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Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ◽

10.1109/stherm.2006.1625198 ◽

2006 ◽

Cited By ~ 1

Author(s):

A. Nabi ◽

P. Rodgers ◽

A. Bar-Cohen

Keyword(s):

Thermal Performance ◽

Performance Degradation ◽

Heat Sinks ◽

Fine Pitch

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Thermal resistance-based bounds for the effective conductivity of composite thermal interface materials

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ◽

10.1109/stherm.2006.1625202 ◽

2006 ◽

Cited By ~ 9

Author(s):

P. Karayacoubian ◽

M.M. Yovanovich ◽

J.R. Culham

Keyword(s):

Thermal Resistance ◽

Effective Conductivity ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

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Coupling surface temperature scanning and ultra-fast adaptive computing to thermally fully characterize complex three-dimensional electronic devices

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ◽

10.1109/stherm.2006.1625229 ◽

2006 ◽

Cited By ~ 6

Author(s):

P.E. Raad ◽

P.L. Komarov ◽

M.G. Burzo

Keyword(s):

Surface Temperature ◽

Electronic Devices ◽

Three Dimensional ◽

Adaptive Computing ◽

Temperature Scanning

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Experimental study on a hybrid liquid/air cooling system

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ◽

10.1109/stherm.2006.1625199 ◽

2006 ◽

Author(s):

Daxi Xiong ◽

K. Azar ◽

B. Tavassoli

Keyword(s):

Experimental Study ◽

Cooling System ◽

Air Cooling ◽

Air Cooling System

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Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal management of an led light engine for airborne applications

Optimization of microchannel heat sinks using entropy generation minimization method

Fundamentals of a floating loop concept based on R134a refrigerant cooling of high heat flux electronics

Optimized thermo-reflectance system for measuring the thermal properties of thin-films and their interfaces

Diamond pins utilized as thermal vias for high heat flux spreading in CTE-compatible lids and substrates for semiconductor packaging

Optimization of doping concentration for three-dimensional bulk silicon microrefrigerators

Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling

Thermal resistance-based bounds for the effective conductivity of composite thermal interface materials

Coupling surface temperature scanning and ultra-fast adaptive computing to thermally fully characterize complex three-dimensional electronic devices

Experimental study on a hybrid liquid/air cooling system

Export Citation Format

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal management of an led light engine for airborne applications

Optimization of microchannel heat sinks using entropy generation minimization method

Fundamentals of a floating loop concept based on R134a refrigerant cooling of high heat flux electronics

Optimized thermo-reflectance system for measuring the thermal properties of thin-films and their interfaces

Diamond pins utilized as thermal vias for high heat flux spreading in CTE-compatible lids and substrates for semiconductor packaging

Optimization of doping concentration for three-dimensional bulk silicon microrefrigerators

Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling

Thermal resistance-based bounds for the effective conductivity of composite thermal interface materials

Coupling surface temperature scanning and ultra-fast adaptive computing to thermally fully characterize complex three-dimensional electronic devices

Experimental study on a hybrid liquid/air cooling system

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium
Latest Publications