Power Electronic Packaging
Latest Publications

TOTAL DOCUMENTS

12

(FIVE YEARS 0)

H-INDEX

1

(FIVE YEARS 0)

Published By Springer New York

9781461410522, 9781461410539

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal Management, Design, and Cooling for Power Electronics

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_6 ◽

2011 ◽

pp. 167-213

Author(s):

Yong Liu

Keyword(s):

Power Electronics ◽

Thermal Management

Download Full-text

Power IC Package Design and Analysis

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_4 ◽

2011 ◽

pp. 57-88

Author(s):

Yong Liu

Keyword(s):

Package Design ◽

Power Ic ◽

Ic Package

Download Full-text

Power Package Thermal and Mechanical Codesign Simulation Automation

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_11 ◽

2011 ◽

pp. 465-515

Author(s):

Yong Liu

Download Full-text

Discrete Power MOSFET Package Design and Analysis

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_3 ◽

2011 ◽

pp. 27-56

Author(s):

Yong Liu

Keyword(s):

Power Mosfet ◽

Package Design

Download Full-text

Material Characterization for Power Electronics Packaging

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_7 ◽

2011 ◽

pp. 215-282

Author(s):

Yong Liu

Keyword(s):

Power Electronics ◽

Material Characterization ◽

Electronics Packaging

Download Full-text

Power Package Electrical Isolation Design

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_2 ◽

2011 ◽

pp. 9-26

Author(s):

Yong Liu

Keyword(s):

Electrical Isolation

Download Full-text

Power Package Typical Assembly Process

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_8 ◽

2011 ◽

pp. 283-344

Author(s):

Yong Liu

Keyword(s):

Assembly Process

Download Full-text

Power Packaging Typical Reliability and Test

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_9 ◽

2011 ◽

pp. 345-425

Author(s):

Yong Liu

Download Full-text

Challenges of Power Electronic Packaging

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_1 ◽

2011 ◽

pp. 1-8 ◽

Cited By ~ 1

Author(s):

Yong Liu

Keyword(s):

Electronic Packaging ◽

Power Electronic

Download Full-text

Power Module/SiP/3D/Stack/Embedded Packaging Design and Considerations

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_5 ◽

2011 ◽

pp. 89-166

Author(s):

Yong Liu

Keyword(s):

Power Module ◽

Packaging Design

Download Full-text