Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350)
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Thermal response of the ultra-performance BGA heat sink in ducted and unducted flow conditions...an experimental investigation

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350) ◽

10.1109/electr.1999.779351 ◽

2003 ◽

Cited By ~ 1

Author(s):

B. Tavassoli

Keyword(s):

Experimental Investigation ◽

Heat Sink ◽

Thermal Response ◽

Flow Conditions

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Use of technical construction files as a method of demonstrating compliance to the EU's EMC directive

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350) ◽

10.1109/electr.1999.779328 ◽

2003 ◽

Author(s):

R.F. Martin

Keyword(s):

Technical Construction

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Cost implications of CSP infrastructure

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350) ◽

10.1109/electr.1999.779334 ◽

2003 ◽

Author(s):

T.A. Hannibal ◽

A.T. Singer

Keyword(s):

Cost Implications

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Alternative temperature chamber designs based on recirculating cooler technology

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350) ◽

10.1109/electr.1999.779331 ◽

2003 ◽

Cited By ~ 1

Author(s):

J.M. Bodah ◽

S. Cianciolo

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The paperless factory

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350) ◽

10.1109/electr.1999.779374 ◽

2003 ◽

Author(s):

M.R. Forrester

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Emerging trends in modeling IC packages in CFD

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350) ◽

10.1109/electr.1999.779353 ◽

2003 ◽

Author(s):

R. Cajina

Keyword(s):

Emerging Trends

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Analysis of thermal transient data with synthesized dynamic models for semiconductor devices

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350) ◽

10.1109/electr.1999.779335 ◽

2003 ◽

Cited By ~ 2

Author(s):

J.W. Sofia

Keyword(s):

Dynamic Models ◽

Semiconductor Devices ◽

Transient Data ◽

Thermal Transient

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CSP package development: the 4.0 manufactur1ng process for μBGA(R)

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350) ◽

10.1109/electr.1999.779333 ◽

2003 ◽

Cited By ~ 1

Author(s):

V. Solberg

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Successful engineering management: seven lessons learned

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350) ◽

10.1109/electr.1999.779365 ◽

2003 ◽

Author(s):

J. Rothman

Keyword(s):

Engineering Management ◽

Lessons Learned

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Designing to maximize flying prober effectiveness

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350) ◽

10.1109/electr.1999.779375 ◽

2003 ◽

Author(s):

B. Russell

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Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal response of the ultra-performance BGA heat sink in ducted and unducted flow conditions...an experimental investigation

Use of technical construction files as a method of demonstrating compliance to the EU's EMC directive

Cost implications of CSP infrastructure

Alternative temperature chamber designs based on recirculating cooler technology

The paperless factory

Emerging trends in modeling IC packages in CFD

Analysis of thermal transient data with synthesized dynamic models for semiconductor devices

CSP package development: the 4.0 manufactur1ng process for μBGA(R)

Successful engineering management: seven lessons learned

Designing to maximize flying prober effectiveness

Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350)
Latest Publications