2013 IEEE Conference on Reliability Science for Advanced Materials and Devices
Latest Publications

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9781467320207

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Electrical conduction effect on reliability of low-k dielectric in Cu interconnect

2013 IEEE Conference on Reliability Science for Advanced Materials and Devices ◽

10.1109/rsamd.2013.6647896 ◽

2013 ◽

Author(s):

Mingte Lin ◽

Alex Juan ◽

K. C. Su

Keyword(s):

Electrical Conduction ◽

Cu Interconnect ◽

Low K

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A toolbox approach to reliably integrating MEMS gyroscopes into harsh acoustic and vibration environments

2013 IEEE Conference on Reliability Science for Advanced Materials and Devices ◽

10.1109/rsamd.2013.6647894 ◽

2013 ◽

Cited By ~ 1

Author(s):

Robert N. Dean ◽

George T. Flowers

Keyword(s):

Mems Gyroscopes

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Advanced X-ray diffraction metrology as a means of improving semiconductor device reliability

2013 IEEE Conference on Reliability Science for Advanced Materials and Devices ◽

10.1109/rsamd.2013.6647895 ◽

2013 ◽

Author(s):

Bruce Gittleman

Keyword(s):

Semiconductor Device ◽

X Ray Diffraction ◽

X Ray ◽

Device Reliability ◽

Semiconductor Device Reliability

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Reliability challenges of FinFET and other multi-gate MOSFETs

2013 IEEE Conference on Reliability Science for Advanced Materials and Devices ◽

10.1109/rsamd.2013.6647897 ◽

2013 ◽

Cited By ~ 1

Author(s):

Javaneh Mohseni ◽

James D. Meindl

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The effect of etch residuals on via reliability

2013 IEEE Conference on Reliability Science for Advanced Materials and Devices ◽

10.1109/rsamd.2013.6647898 ◽

2013 ◽

Author(s):

Shawn A. Adderly ◽

Matthew D. Moon ◽

Max L. Lifson ◽

Nathaniel W. Bowe ◽

Jeffrey P. Gambino ◽

...

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2013 IEEE Conference on Reliability Science for Advanced Materials and DevicesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Electrical conduction effect on reliability of low-k dielectric in Cu interconnect

A toolbox approach to reliably integrating MEMS gyroscopes into harsh acoustic and vibration environments

Advanced X-ray diffraction metrology as a means of improving semiconductor device reliability

Reliability challenges of FinFET and other multi-gate MOSFETs

The effect of etch residuals on via reliability

2013 IEEE Conference on Reliability Science for Advanced Materials and Devices
Latest Publications