2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)
Latest Publications

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(FIVE YEARS 0)

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(FIVE YEARS 0)

Published By IEEE

9782355000027

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Copper-filled macroporous Si for microchannel heat sink tecnology

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2007.4451747 ◽

2007 ◽

Author(s):

Filimon Zacharatos ◽

Androula Nassiopoulou

Keyword(s):

Heat Sink ◽

Microchannel Heat Sink

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Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2007.4451756 ◽

2007 ◽

Cited By ~ 4

Author(s):

B. Wunderle ◽

M. Schneider-Ramelow ◽

B. Michel ◽

H. Reichl ◽

T. Braun ◽

...

Keyword(s):

Failure Analysis ◽

Mechanical Loading ◽

Non Destructive

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2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2007.4451783 ◽

2007 ◽

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Inverse damage detection in IC packaging component

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2007.4451780 ◽

2007 ◽

Author(s):

Chun-Yin Wu ◽

Wen-Chang Lin

Keyword(s):

Damage Detection ◽

Ic Packaging

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Utility of transient testing to characterize thermal interface materials

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2007.4451738 ◽

2007 ◽

Cited By ~ 15

Author(s):

B. Smith ◽

T. Brunschwiler ◽

B. Michel

Keyword(s):

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

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Method of images for the fast calculation of temperature distributions in packaged VLSI chips

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2007.4451740 ◽

2007 ◽

Cited By ~ 14

Author(s):

Virginia Martin Heriz ◽

Je-Hyoung Park ◽

Travis Kemper ◽

Sung-Mo Kang ◽

Ali Shakouri

Keyword(s):

Method Of Images ◽

Fast Calculation ◽

Temperature Distributions ◽

Vlsi Chips

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Abstracting / indexing

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2007.4451732 ◽

2007 ◽

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13th international workshop on THERMal INvestigation of ICs and systems

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2007.4451731 ◽

2007 ◽

Keyword(s):

International Workshop ◽

Thermal Investigation

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Dynamic electrothermal simulation of integrated resistors at device level

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2007.4451777 ◽

2007 ◽

Author(s):

Bjorn Vermeersch ◽

Gilbert De Mey

Keyword(s):

Electrothermal Simulation ◽

Integrated Resistors

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Development of EHD ion-drag micropump for microscale electronics cooling

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2007.4451745 ◽

2007 ◽

Cited By ~ 6

Author(s):

C.K. Lee ◽

A.J. Robinson ◽

C.Y. Ching

Keyword(s):

Electronics Cooling

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2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Copper-filled macroporous Si for microchannel heat sink tecnology

Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading

Blank page

Inverse damage detection in IC packaging component

Utility of transient testing to characterize thermal interface materials

Method of images for the fast calculation of temperature distributions in packaged VLSI chips

Abstracting / indexing

13th international workshop on THERMal INvestigation of ICs and systems

Dynamic electrothermal simulation of integrated resistors at device level

Development of EHD ion-drag micropump for microscale electronics cooling

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)
Latest Publications