2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications

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9781728160702

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IMPACT 2019 Future Events Page

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact47228.2019.9024987 ◽

2019 ◽

Keyword(s):

Future Events

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LTD PKG. (Liquid Thermal Dissipation Package) Technology

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact47228.2019.9024979 ◽

2019 ◽

Author(s):

Yu Lung Huang ◽

C. Key Chung ◽

C.F. Lin ◽

Bruce Xu ◽

Yunn Shiuan Liao

Keyword(s):

Thermal Dissipation

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IMPACT 2019 Welcome Message

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact47228.2019.9024964 ◽

2019 ◽

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Enabling the Next Generation PAM4 ~50Gbps Signaling In Ceramic Package Substrate Application

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact47228.2019.9024971 ◽

2019 ◽

Author(s):

Michael Chang

Keyword(s):

Next Generation

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6-DoF Force/Torque Sensor

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact47228.2019.9024986 ◽

2019 ◽

Author(s):

Chih-Che Lin ◽

Chung-Yuan Su ◽

Shih-Ting Lin ◽

Chih-Yuan Chen ◽

Chien-Nan Yeh ◽

...

Keyword(s):

Torque Sensor

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SERDES Transceiver for Supply-Induced Jitter Sensitivity Methodology Based on PDN analysis

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact47228.2019.9024989 ◽

2019 ◽

Cited By ~ 2

Author(s):

Michael Chang

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Study on the Assembly Technology of Die-First/Face-Down Type FO-PLP

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact47228.2019.9024997 ◽

2019 ◽

Author(s):

Masaaki Takekoshi ◽

Kenji Shimada ◽

Naoya Suzuki ◽

Toshihisa Nonaka

Keyword(s):

Assembly Technology

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Study of Improvement and Verification for Fan Wall of Network Rack Server using Six Sigma

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact47228.2019.9024965 ◽

2019 ◽

Cited By ~ 1

Author(s):

Kuo-Chi Chang ◽

Kai-Chun Chu ◽

Tsou-Li Chen ◽

Yueh-Lung Ward Lee ◽

Yuh-Chung Lin ◽

...

Keyword(s):

Six Sigma

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Study of the High-tech Process Mechanical Integrity and Electrical Safety

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact47228.2019.9024999 ◽

2019 ◽

Cited By ~ 3

Author(s):

Kuo-Chi Chang ◽

Kai-Chun Chu ◽

Tsou-Li Chen ◽

Yueh-Lung Ward Lee ◽

Yuh-Chung Lin ◽

...

Keyword(s):

Electrical Safety ◽

High Tech ◽

Mechanical Integrity

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Characterizing Wideband Permittivities of 5G CCL and FCCL Using Split-Cylinder Resonators

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact47228.2019.9024955 ◽

2019 ◽

Author(s):

Kuen-Fwu Fuh ◽

Tsung-Wen Chen

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2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

IMPACT 2019 Future Events Page

LTD PKG. (Liquid Thermal Dissipation Package) Technology

IMPACT 2019 Welcome Message

Enabling the Next Generation PAM4 ~50Gbps Signaling In Ceramic Package Substrate Application

6-DoF Force/Torque Sensor

SERDES Transceiver for Supply-Induced Jitter Sensitivity Methodology Based on PDN analysis

Study on the Assembly Technology of Die-First/Face-Down Type FO-PLP

Study of Improvement and Verification for Fan Wall of Network Rack Server using Six Sigma

Study of the High-tech Process Mechanical Integrity and Electrical Safety

Characterizing Wideband Permittivities of 5G CCL and FCCL Using Split-Cylinder Resonators

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications