Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
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Published By Springer Berlin Heidelberg

9783642061158, 9783662079287

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Three-Dimensional Feature-Scale Modeling of CMP

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication ◽

10.1007/978-3-662-07928-7_7 ◽

2004 ◽

pp. 237-254

Author(s):

Jianfeng Luo ◽

David A. Dornfeld

Keyword(s):

Three Dimensional ◽

Scale Modeling ◽

Feature Scale

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Review of CMP Modeling

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication ◽

10.1007/978-3-662-07928-7_2 ◽

2004 ◽

pp. 15-52

Author(s):

Jianfeng Luo ◽

David A. Dornfeld

Keyword(s):

Cmp Modeling

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Wafer-Scale Modeling of CMP

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication ◽

10.1007/978-3-662-07928-7_8 ◽

2004 ◽

pp. 255-284

Author(s):

Jianfeng Luo ◽

David A. Dornfeld

Keyword(s):

Wafer Scale ◽

Scale Modeling

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Material Removal Regions in CMP: Coupling Effects of Slurry Chemicals, Abrasive Particle Size Distribution and Wafer-Pad Contact Area

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication ◽

10.1007/978-3-662-07928-7_5 ◽

2004 ◽

pp. 115-145

Author(s):

Jianfeng Luo ◽

David A. Dornfeld

Keyword(s):

Particle Size ◽

Particle Size Distribution ◽

Size Distribution ◽

Contact Area ◽

Material Removal ◽

Abrasive Particle ◽

Coupling Effects

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Effects of Abrasive Size Distribution in CMP

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication ◽

10.1007/978-3-662-07928-7_4 ◽

2004 ◽

pp. 97-113 ◽

Cited By ~ 1

Author(s):

Jianfeng Luo ◽

David A. Dornfeld

Keyword(s):

Size Distribution ◽

Abrasive Size

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One and Semi-Two Dimensional Feature- and Die-Scale Modeling for the Damascene Process

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication ◽

10.1007/978-3-662-07928-7_6 ◽

2004 ◽

pp. 147-235

Author(s):

Jianfeng Luo ◽

David A. Dornfeld

Keyword(s):

Two Dimensional ◽

Damascene Process ◽

Scale Modeling

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Introduction

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication ◽

10.1007/978-3-662-07928-7_1 ◽

2004 ◽

pp. 1-13

Author(s):

Jianfeng Luo ◽

David A. Dornfeld

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Summary and Future Work

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication ◽

10.1007/978-3-662-07928-7_9 ◽

2004 ◽

pp. 285-295

Author(s):

Jianfeng Luo ◽

David A. Dornfeld

Keyword(s):

Future Work

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Material Removal Mechanism in CMP: A Comprehensive Model of Abrasive Particle, Pad Asperity and Wafer Interactions

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication ◽

10.1007/978-3-662-07928-7_3 ◽

2004 ◽

pp. 53-95

Author(s):

Jianfeng Luo ◽

David A. Dornfeld

Keyword(s):

Material Removal ◽

Abrasive Particle ◽

Comprehensive Model ◽

Removal Mechanism ◽

Material Removal Mechanism

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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC FabricationLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer Berlin Heidelberg

Three-Dimensional Feature-Scale Modeling of CMP

Review of CMP Modeling

Wafer-Scale Modeling of CMP

Material Removal Regions in CMP: Coupling Effects of Slurry Chemicals, Abrasive Particle Size Distribution and Wafer-Pad Contact Area

Effects of Abrasive Size Distribution in CMP

One and Semi-Two Dimensional Feature- and Die-Scale Modeling for the Damascene Process

Introduction

Summary and Future Work

Material Removal Mechanism in CMP: A Comprehensive Model of Abrasive Particle, Pad Asperity and Wafer Interactions

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Latest Publications