Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging
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Full wave characterization of a through hole via discontinuity in multi-layered packaging

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594151 ◽

2002 ◽

Cited By ~ 1

Author(s):

Show-Gwo Hsu ◽

Ruey-Beei Wu

Keyword(s):

Full Wave ◽

Through Hole

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A model to hardware comparison of simultaneous switching noise on a CMOS chip

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594066 ◽

2002 ◽

Cited By ~ 3

Author(s):

B. McCredie ◽

S. Kuppinger ◽

G. Katopis ◽

W.D. Becker

Keyword(s):

Switching Noise ◽

Simultaneous Switching Noise ◽

Cmos Chip ◽

Simultaneous Switching

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Direct computation of reduced-order models for circuit simulation of 3-D interconnect structures

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594162 ◽

2002 ◽

Cited By ~ 4

Author(s):

L.M. Silveira ◽

M. Kamon ◽

J. White

Keyword(s):

Circuit Simulation ◽

Reduced Order Models ◽

Direct Computation ◽

Reduced Order

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Progress in circuit oriented techniques for electrical interconnect and package (EIP) modeling

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594073 ◽

2002 ◽

Author(s):

A. Ruehli

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A compact LTCC multilayer multiport stripline coupler network for wideband low loss power combining/splitting

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594129 ◽

2002 ◽

Cited By ~ 5

Author(s):

J.W. Gipprich ◽

L.E. Dickens ◽

R.E. Hayes ◽

M.A. Restivo

Keyword(s):

Low Loss ◽

Power Combining

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Use of periodic structure approach to model packaged MMIC and interconnects

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594111 ◽

2002 ◽

Cited By ~ 1

Author(s):

P. Petre ◽

K. Kottapalli ◽

M. Swaminathan

Keyword(s):

Periodic Structure ◽

Structure Approach

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Metrics for RLC transmission line termination

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594059 ◽

2002 ◽

Cited By ~ 3

Author(s):

J. Willis ◽

R. Gupta ◽

L. Pillage

Keyword(s):

Transmission Line

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Circuit modelling of two-port interconnection structures based on causality

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594142 ◽

2002 ◽

Cited By ~ 4

Author(s):

S. Sercu ◽

L. Martens

Keyword(s):

Circuit Modelling

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The interconnected mesh power system (IMPS) MCM topology

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594155 ◽

2002 ◽

Author(s):

Y.L. Low ◽

L.W. Schaper ◽

S. Ang ◽

D. Oldham

Keyword(s):

Power System

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Calculation of far zone electromagnetic fields radiated from structures in multilayer printed circuit boards

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594071 ◽

2002 ◽

Cited By ~ 2

Author(s):

G. Aguirre ◽

L. Vakanas ◽

A.C. Cangellaris

Keyword(s):

Electromagnetic Fields ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit

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Proceedings of 1994 IEEE Electrical Performance of Electronic PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Full wave characterization of a through hole via discontinuity in multi-layered packaging

A model to hardware comparison of simultaneous switching noise on a CMOS chip

Direct computation of reduced-order models for circuit simulation of 3-D interconnect structures

Progress in circuit oriented techniques for electrical interconnect and package (EIP) modeling

A compact LTCC multilayer multiport stripline coupler network for wideband low loss power combining/splitting

Use of periodic structure approach to model packaged MMIC and interconnects

Metrics for RLC transmission line termination

Circuit modelling of two-port interconnection structures based on causality

The interconnected mesh power system (IMPS) MCM topology

Calculation of far zone electromagnetic fields radiated from structures in multilayer printed circuit boards

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging
Latest Publications