3D Microelectronic Packaging - Springer Series in Advanced Microelectronics
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Published By Springer Singapore

9789811570896, 9789811570902

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Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-981-15-7090-2_8 ◽

2020 ◽

pp. 201-231

Author(s):

Tadatomo Suga ◽

Ran He ◽

George Vakanas ◽

Antonio La Manna

Keyword(s):

3D Packaging ◽

Cu Bonding

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Phase-Field-Crystal Model: A Tool for Probing Atoms in TSV

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-981-15-7090-2_5 ◽

2020 ◽

pp. 107-130

Author(s):

Jinxin Liu ◽

Zhiheng Huang ◽

Paul Conway ◽

Yang Liu

Keyword(s):

Phase Field ◽

Crystal Model ◽

Phase Field Crystal

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Microstructure and Mechanical Reliability Issues of TSV

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-981-15-7090-2_4 ◽

2020 ◽

pp. 71-105

Author(s):

Praveen Kumar ◽

Tae-Kyu Lee ◽

Indranath Dutta ◽

Zhiheng Huang ◽

Paul Conway

Keyword(s):

Mechanical Reliability

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Fundamentals of Advanced Materials and Processes in Organic Substrate Technology

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-981-15-7090-2_14 ◽

2020 ◽

pp. 397-429

Author(s):

Songhua Shi ◽

Peter Tortorici ◽

Sai Vadlamani ◽

Prithwish Chatterjee

Keyword(s):

Organic Substrate ◽

Advanced Materials

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Fundamentals and Failures in Die Preparation for 3D Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-981-15-7090-2_7 ◽

2020 ◽

pp. 157-199

Author(s):

Huan Ma ◽

Hualiang Shi ◽

Erasenthiran Poonjolai

Keyword(s):

3D Packaging

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Fault Isolation and Failure Analysis of 3D Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-981-15-7090-2_18 ◽

2020 ◽

pp. 575-617

Author(s):

Yan Li ◽

Deepak Goyal

Keyword(s):

Failure Analysis ◽

Fault Isolation ◽

3D Packaging

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Processing and Reliability of Solder Interconnections in Stacked Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-981-15-7090-2_16 ◽

2020 ◽

pp. 471-526

Author(s):

Paul Vianco ◽

Mike Neilsen

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Fundamentals of Solder Alloys in 3D Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-981-15-7090-2_11 ◽

2020 ◽

pp. 329-346

Author(s):

Kwang-Lung Lin

Keyword(s):

Solder Alloys ◽

3D Packaging

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3D Packaging Architectures and Assembly Process Design

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-981-15-7090-2_2 ◽

2020 ◽

pp. 17-45

Author(s):

Ravi Mahajan ◽

Bob Sankman

Keyword(s):

Process Design ◽

Assembly Process ◽

3D Packaging

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Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-981-15-7090-2_15 ◽

2020 ◽

pp. 431-469

Author(s):

Liangbiao Chen ◽

Tengfei Jiang ◽

Xuejun Fan

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3D Microelectronic Packaging - Springer Series in Advanced MicroelectronicsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer Singapore

Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging

Phase-Field-Crystal Model: A Tool for Probing Atoms in TSV

Microstructure and Mechanical Reliability Issues of TSV

Fundamentals of Advanced Materials and Processes in Organic Substrate Technology

Fundamentals and Failures in Die Preparation for 3D Packaging

Fault Isolation and Failure Analysis of 3D Packaging

Processing and Reliability of Solder Interconnections in Stacked Packaging

Fundamentals of Solder Alloys in 3D Packaging

3D Packaging Architectures and Assembly Process Design

Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics
Latest Publications