Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.
Latest Publications

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0769518818

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Impact of interoperability on CAD-IP reuse: an academic viewpoint

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. ◽

10.1109/isqed.2003.1194733 ◽

2004 ◽

Cited By ~ 1

Author(s):

A.B. Kahng ◽

I.L. Markov

Keyword(s):

Ip Reuse

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Compact dictionaries for fault diagnosis in BIST

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. ◽

10.1109/isqed.2003.1194717 ◽

2004 ◽

Author(s):

Chunsheng Liu ◽

K. Chakrabarty

Keyword(s):

Fault Diagnosis

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Investigation of the capacitance deviation due to metal-fills and the effective interconnect geometry modeling

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. ◽

10.1109/isqed.2003.1194761 ◽

2004 ◽

Author(s):

Won-Seok Lee ◽

Keun-Ho Lee ◽

Jin-Kyu Park ◽

Tae-Kyung Kim ◽

Young-Kwan Park ◽

...

Keyword(s):

Geometry Modeling

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An embedded I/sub DDQ/ testing architecture and technique

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. ◽

10.1109/isqed.2003.1194773 ◽

2004 ◽

Cited By ~ 1

Author(s):

Y. Tsiatouhas ◽

T. Haniotakis ◽

A. Arapoyanni

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Interoperability beyond design: sharing knowledge between design and manufacturing

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. ◽

10.1109/isqed.2003.1194734 ◽

2004 ◽

Cited By ~ 2

Author(s):

D.R. Cottrell ◽

T.J. Grebinski

Keyword(s):

Design And Manufacturing

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On-chip interconnect inductance - friend or foe

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. ◽

10.1109/isqed.2003.1194764 ◽

2004 ◽

Cited By ~ 1

Author(s):

S.S. Wong ◽

P. Yue ◽

R. Chang ◽

So-Young Kim ◽

B. Kleveland ◽

...

Keyword(s):

On Chip

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Procedural analog design (PAD) tool

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. ◽

10.1109/isqed.2003.1194751 ◽

2004 ◽

Cited By ~ 10

Author(s):

D. Stefanovic ◽

M. Kayal ◽

M. Pastre ◽

V.B. Litovski

Keyword(s):

Analog Design

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Automatic repositioning technique for digital cell based window comparators and implementation within mixed-signal DfT schemes

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. ◽

10.1109/isqed.2003.1194771 ◽

2004 ◽

Cited By ~ 16

Author(s):

D. De Venuto ◽

M.J. Ohletz ◽

B. Ricco

Keyword(s):

Mixed Signal

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Electrical and thermal analysis for system-in-a package (SiP) implementation platform

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. ◽

10.1109/isqed.2003.1194736 ◽

2004 ◽

Cited By ~ 3

Author(s):

M. Wang ◽

K. Suzuki ◽

W. Dai

Keyword(s):

Thermal Analysis

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Advanced module packaging method

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. ◽

10.1109/isqed.2003.1194735 ◽

2004 ◽

Author(s):

P.C. Salmon

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Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Impact of interoperability on CAD-IP reuse: an academic viewpoint

Compact dictionaries for fault diagnosis in BIST

Investigation of the capacitance deviation due to metal-fills and the effective interconnect geometry modeling

An embedded I/sub DDQ/ testing architecture and technique

Interoperability beyond design: sharing knowledge between design and manufacturing

On-chip interconnect inductance - friend or foe

Procedural analog design (PAD) tool

Automatic repositioning technique for digital cell based window comparators and implementation within mixed-signal DfT schemes

Electrical and thermal analysis for system-in-a package (SiP) implementation platform

Advanced module packaging method

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.
Latest Publications