Proceedings of IEEE Electrical Performance of Electronic Packaging
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Electrical characterization of packaging environment using switching noise generating vehicle

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394551 ◽

2002 ◽

Cited By ~ 9

Author(s):

T. Sudo ◽

M. Miura ◽

N. Hirano ◽

Y. Hiruta

Keyword(s):

Electrical Characterization ◽

Switching Noise

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Role of driver loading conditions on simultaneous switching noise

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394552 ◽

2002 ◽

Cited By ~ 2

Author(s):

A. Vaidyanath ◽

B. Thoroddsen ◽

J.L. Prince

Keyword(s):

Switching Noise ◽

Loading Conditions ◽

Simultaneous Switching Noise ◽

Simultaneous Switching

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Crosstalk as an attenuation mechanism in coupled microstrip transmission lines

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394550 ◽

2002 ◽

Cited By ~ 3

Author(s):

M.A. Bruns ◽

S.H. Pepper

Keyword(s):

Transmission Lines ◽

Attenuation Mechanism ◽

Microstrip Transmission Lines

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On the extraction of circuit parameters of microstrip elements from MOM-Computed currents

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394592 ◽

2002 ◽

Author(s):

K. Naishadham

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Flip chip interconnect of 2.5-watt CPW power amplifier MMIC

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394598 ◽

2002 ◽

Cited By ~ 2

Author(s):

C.K. Pao ◽

W.S. Wong ◽

W.D. Gray ◽

C. Liu ◽

D.C. Wang ◽

...

Keyword(s):

Power Amplifier ◽

Flip Chip

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Electrical packaging requirements for low voltage ICs-3.3 V High Performance CMOS devices as a case study

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394604 ◽

2002 ◽

Author(s):

R. Senthinathan ◽

A. Mehra ◽

M. Mahalingam ◽

Y. Doi ◽

H. Astrain

Keyword(s):

High Performance ◽

Low Voltage

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Efficient computation of ground plane inductances and currents

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394572 ◽

2002 ◽

Cited By ~ 4

Author(s):

R. Raghuram ◽

D. Divekar ◽

P. Wang

Keyword(s):

Ground Plane ◽

Efficient Computation

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Calculation of multi-port parameters of electronic packages using a general purpose electromagnetics code

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394596 ◽

2002 ◽

Cited By ~ 30

Author(s):

B.J. Rubin ◽

S. Daijavad

Keyword(s):

General Purpose ◽

Electronic Packages

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Comparison of driver models for the computer-aided analysis of electronic packages

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394555 ◽

2002 ◽

Author(s):

S.N. Pratapneni ◽

C.M. Wolff ◽

N. Cherukuri ◽

J.L. Prince

Keyword(s):

Electronic Packages ◽

Computer Aided Analysis ◽

Computer Aided

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EM analysis of low inductance decoupling capacitors

Proceedings of IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1993.394585 ◽

2002 ◽

Cited By ~ 2

Author(s):

B. Beker ◽

G. Cokkinides ◽

A. Templeton

Keyword(s):

Decoupling Capacitors

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Proceedings of IEEE Electrical Performance of Electronic PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Electrical characterization of packaging environment using switching noise generating vehicle

Role of driver loading conditions on simultaneous switching noise

Crosstalk as an attenuation mechanism in coupled microstrip transmission lines

On the extraction of circuit parameters of microstrip elements from MOM-Computed currents

Flip chip interconnect of 2.5-watt CPW power amplifier MMIC

Electrical packaging requirements for low voltage ICs-3.3 V High Performance CMOS devices as a case study

Efficient computation of ground plane inductances and currents

Calculation of multi-port parameters of electronic packages using a general purpose electromagnetics code

Comparison of driver models for the computer-aided analysis of electronic packages

EM analysis of low inductance decoupling capacitors

Proceedings of IEEE Electrical Performance of Electronic Packaging
Latest Publications