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Published By Springer New York

9781461404620, 9781461404637

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Erratum to: Theory on Mechanics of Solder Materials

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10.1007/978-1-4614-0463-7_9 ◽

2018 ◽

pp. E1-E1

Author(s):

J. H. L. Pang

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Thermo-Mechanical Reliability Test and Analysis

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10.1007/978-1-4614-0463-7_6 ◽

2011 ◽

pp. 89-122

Author(s):

John Hock Lye Pang

Keyword(s):

Reliability Test ◽

Mechanical Reliability

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Theory on Mechanics of Solder Materials

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10.1007/978-1-4614-0463-7_2 ◽

2011 ◽

pp. 7-22

Author(s):

John Hock Lye Pang

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Fatigue Life Prediction Models

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10.1007/978-1-4614-0463-7_4 ◽

2011 ◽

pp. 49-63

Author(s):

John Hock Lye Pang

Keyword(s):

Fatigue Life ◽

Life Prediction ◽

Prediction Models ◽

Fatigue Life Prediction

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Mechanical Properties and Constitutive Models

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10.1007/978-1-4614-0463-7_3 ◽

2011 ◽

pp. 23-48

Author(s):

John Hock Lye Pang

Keyword(s):

Mechanical Properties ◽

Constitutive Models

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Dynamic Mechanical Reliability Test and Analysis

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10.1007/978-1-4614-0463-7_7 ◽

2011 ◽

pp. 123-153

Author(s):

John Hock Lye Pang

Keyword(s):

Reliability Test ◽

Mechanical Reliability ◽

Dynamic Mechanical

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Finite Element Analysis and Design-for-Reliability

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10.1007/978-1-4614-0463-7_5 ◽

2011 ◽

pp. 65-88

Author(s):

John Hock Lye Pang

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Element Analysis ◽

Design For Reliability ◽

Analysis And Design

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Introduction

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10.1007/978-1-4614-0463-7_1 ◽

2011 ◽

pp. 1-5

Author(s):

John Hock Lye Pang

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Thermal Cycling Aging Effects on Board-Level Drop Test Result

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10.1007/978-1-4614-0463-7_8 ◽

2011 ◽

pp. 155-170

Author(s):

John Hock Lye Pang

Keyword(s):

Thermal Cycling ◽

Drop Test ◽

Aging Effects ◽

Board Level ◽

Test Result

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