[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems
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Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronics

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems ◽

10.1109/itherm.1992.187749 ◽

2003 ◽

Cited By ~ 3

Author(s):

K.E. Goodson ◽

M.I. Flik

Keyword(s):

Thermal Conduction ◽

Silicon On Insulator

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Mixed convection in an inclined channel with a discrete heat source

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems ◽

10.1109/itherm.1992.187739 ◽

2003 ◽

Cited By ~ 1

Author(s):

C.Y. Choi ◽

A. Ortega

Keyword(s):

Heat Source ◽

Mixed Convection ◽

Inclined Channel ◽

Discrete Heat Source

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Transient thermal gradients across solder interconnections in electronic systems

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems ◽

10.1109/itherm.1992.187767 ◽

2003 ◽

Cited By ~ 3

Author(s):

R.A. Sherif ◽

H.B. Schwartz ◽

R.A. Brewster

Keyword(s):

Electronic Systems ◽

Thermal Gradients ◽

Transient Thermal

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A coupled thermal-magnetic model for high frequency transformers. I. Model formulation and material properties

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems ◽

10.1109/itherm.1992.187737 ◽

2003 ◽

Cited By ~ 2

Author(s):

D.J. Nelson ◽

J.P. Jessee

Keyword(s):

Material Properties ◽

High Frequency ◽

Model Formulation ◽

Magnetic Model

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Boiling binary mixtures at subatmospheric pressures

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems ◽

10.1109/itherm.1992.187750 ◽

2003 ◽

Cited By ~ 3

Author(s):

W.R. McGillis ◽

V.P. Carey ◽

J.S. Fitch ◽

W.R. Hamburgen

Keyword(s):

Binary Mixtures

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Cooling characteristics of forced air convection in electronic cabinets

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems ◽

10.1109/itherm.1992.187751 ◽

2003 ◽

Author(s):

W.T. Kim ◽

J.H. Park ◽

H.G. Rho ◽

K.S. Kim

Keyword(s):

Air Convection ◽

Forced Air

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A data shifter-the vehicle for study of thermal-electrical interactions in integrated circuits

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems ◽

10.1109/itherm.1992.187762 ◽

2003 ◽

Author(s):

W. Nakayama

Keyword(s):

Integrated Circuits

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Effect of mold compound thermal conductivity on IC package thermal performance

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems ◽

10.1109/itherm.1992.187769 ◽

2003 ◽

Cited By ~ 18

Author(s):

M. Michael ◽

L. Nguyen

Keyword(s):

Thermal Conductivity ◽

Thermal Performance ◽

Ic Package

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High density multichip systems

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems ◽

10.1109/itherm.1992.187764 ◽

2003 ◽

Author(s):

D. Herrell

Keyword(s):

High Density

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A technique for enhancing boiling heat transfer with application to cooling of electronic equipment

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems ◽

10.1109/itherm.1992.187742 ◽

2003 ◽

Cited By ~ 5

Author(s):

S.M. You ◽

T.W. Simon ◽

A. Bar-Cohen

Keyword(s):

Heat Transfer ◽

Boiling Heat Transfer ◽

Electronic Equipment

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[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic SystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronics

Mixed convection in an inclined channel with a discrete heat source

Transient thermal gradients across solder interconnections in electronic systems

A coupled thermal-magnetic model for high frequency transformers. I. Model formulation and material properties

Boiling binary mixtures at subatmospheric pressures

Cooling characteristics of forced air convection in electronic cabinets

A data shifter-the vehicle for study of thermal-electrical interactions in integrated circuits

Effect of mold compound thermal conductivity on IC package thermal performance

High density multichip systems

A technique for enhancing boiling heat transfer with application to cooling of electronic equipment

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems
Latest Publications