Electrical Performance of Electronic Packaging
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59

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7

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Published By IEEE

0780342038

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Measurement and field simulation based characterization of plastic IC packages

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1997.634066 ◽

2002 ◽

Cited By ~ 5

Author(s):

F. Mernyei

Keyword(s):

Field Simulation ◽

Simulation Based

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Standardizable and automated procedures to measure and simulate very complex 3D packaging parasitics with highest accuracy, shown for a TSOP50 as example

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1997.634067 ◽

2002 ◽

Author(s):

E. Miersch ◽

S. Muff ◽

M.G. Jin

Keyword(s):

3D Packaging ◽

Automated Procedures

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Low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1997.634033 ◽

2002 ◽

Author(s):

S. Koike ◽

K. Kaizu

Keyword(s):

Low Cost ◽

Switching Noise ◽

Simultaneous Switching Noise ◽

Simultaneous Switching

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Delta-I noise avoidance methodology for high performance chip designs [CMOS microprocessors]

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1997.634030 ◽

2002 ◽

Cited By ~ 3

Author(s):

M. Cases ◽

B. Singh ◽

H. Smith

Keyword(s):

High Performance

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High frequency characterization of interconnection on glass fiber inforced PCB (G30)

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1997.634042 ◽

2002 ◽

Cited By ~ 1

Author(s):

A. Owzar ◽

C.M. Weickhmann ◽

F. Fazelpour ◽

P. Windirsch ◽

J. Reimers ◽

...

Keyword(s):

Glass Fiber ◽

High Frequency

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Quasi-TEM model for coplanar waveguide on silicon

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1997.634076 ◽

2002 ◽

Cited By ~ 7

Author(s):

D.F. Williams ◽

M.D. Janezic ◽

A.R.K. Ralston ◽

R.S. List

Keyword(s):

Coplanar Waveguide

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Wideband crosstalk analysis of coupled bondwires buried in high-speed plastic packages

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1997.634046 ◽

2002 ◽

Cited By ~ 1

Author(s):

Sang-Ki Yun ◽

Hai-Young Lee

Keyword(s):

High Speed ◽

Plastic Packages

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Generating reduced order models via PEEC for capturing skin and proximity effects

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1997.634084 ◽

2002 ◽

Cited By ~ 12

Author(s):

M. Kamon ◽

N. Marques ◽

L.M. Silveira ◽

J. White

Keyword(s):

Proximity Effects ◽

Reduced Order Models ◽

Reduced Order

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Characterization, modeling and optimization of high power module packaging

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1997.634049 ◽

2002 ◽

Author(s):

M. Trivedi ◽

K. Shenai

Keyword(s):

High Power ◽

Power Module ◽

Modeling And Optimization

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An introduction to the fast-MoM in computational electromagnetics

Electrical Performance of Electronic Packaging ◽

10.1109/epep.1997.634077 ◽

2002 ◽

Author(s):

A.R. Baghai-Wadji

Keyword(s):

Computational Electromagnetics

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