Electronics Packaging Forum
Latest Publications

TOTAL DOCUMENTS

14

(FIVE YEARS 0)

H-INDEX

1

(FIVE YEARS 0)

Published By Springer Netherlands

9789401066815, 9789400904392

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Stress Analysis for Component-Populated Circuit Cards

Electronics Packaging Forum ◽

10.1007/978-94-009-0439-2_2 ◽

1991 ◽

pp. 85-102

Author(s):

Peter A. Engel

Keyword(s):

Stress Analysis

Download Full-text

Microelectronics Packaging/Interconnect: An Industry in Transition

Electronics Packaging Forum ◽

10.1007/978-94-009-0439-2_14 ◽

1991 ◽

pp. 437-449 ◽

Cited By ~ 1

Author(s):

Daniel C. Blazej

Keyword(s):

Microelectronics Packaging

Download Full-text

Heat Sinks in Forced Convection Cooling

Electronics Packaging Forum ◽

10.1007/978-94-009-0439-2_6 ◽

1991 ◽

pp. 209-228 ◽

Cited By ~ 1

Author(s):

Gary L. Lehmann

Keyword(s):

Forced Convection ◽

Heat Sinks ◽

Convection Cooling

Download Full-text

Integrated Optical Devices Based on Silica Waveguide Technology

Electronics Packaging Forum ◽

10.1007/978-94-009-0439-2_9 ◽

1991 ◽

pp. 281-295 ◽

Cited By ~ 1

Author(s):

Tadashi Miyashita

Keyword(s):

Optical Devices ◽

Integrated Optical ◽

Integrated Optical Devices

Download Full-text

Low Dielectric Constant Materials for Packaging High Speed Electronics

Electronics Packaging Forum ◽

10.1007/978-94-009-0439-2_8 ◽

1991 ◽

pp. 247-280

Author(s):

Melvin P. Zussman

Keyword(s):

Dielectric Constant ◽

High Speed ◽

Low Dielectric Constant ◽

Low Dielectric ◽

Low Dielectric Constant Materials

Download Full-text

Diamond Thin Films: Applications in Electronics Packaging

Electronics Packaging Forum ◽

10.1007/978-94-009-0439-2_7 ◽

1991 ◽

pp. 229-245

Author(s):

Lynn Sui-Yuan ◽

D. Garg ◽

D. S. Hoover

Keyword(s):

Thin Films ◽

Electronics Packaging ◽

Diamond Thin Films

Download Full-text

Recent Developments in Thermal Technology for Electronics Packaging

Electronics Packaging Forum ◽

10.1007/978-94-009-0439-2_5 ◽

1991 ◽

pp. 183-208

Author(s):

Richard C. Chu ◽

Robert E. Simons

Keyword(s):

Electronics Packaging ◽

Recent Developments

Download Full-text

An Introduction to Tape Automated Bonding Technology

Electronics Packaging Forum ◽

10.1007/978-94-009-0439-2_1 ◽

1991 ◽

pp. 1-83 ◽

Cited By ~ 3

Author(s):

John H. Lau ◽

Steve J. Erasmus ◽

Donald W. Rice

Keyword(s):

Bonding Technology

Download Full-text

Power Technology Packaging for the 90s

Electronics Packaging Forum ◽

10.1007/978-94-009-0439-2_4 ◽

1991 ◽

pp. 139-181

Author(s):

Craig D. Smith

Download Full-text

Parameterization of Fine Pitch Processing

Electronics Packaging Forum ◽

10.1007/978-94-009-0439-2_13 ◽

1991 ◽

pp. 395-436

Author(s):

George R. Westby ◽

Michael D. Snyder

Keyword(s):

Pitch Processing ◽

Fine Pitch

Download Full-text