Handbook Of Electronics Packaging Design and Engineering
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Published By Springer Netherlands

9789401170499, 9789401170475

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Metal Alloy and Temper Designation Systems

Handbook Of Electronics Packaging Design and Engineering ◽

10.1007/978-94-011-7047-5_26 ◽

1990 ◽

pp. 511-534

Author(s):

Bernard S. Matisoff

Keyword(s):

Metal Alloy

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Mechanics of Simple Stresses

Handbook Of Electronics Packaging Design and Engineering ◽

10.1007/978-94-011-7047-5_21 ◽

1990 ◽

pp. 428-439

Author(s):

Bernard S. Matisoff

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Electronics Packaging Design and Engineering

Handbook Of Electronics Packaging Design and Engineering ◽

10.1007/978-94-011-7047-5_1 ◽

1990 ◽

pp. 1-5

Author(s):

Bernard S. Matisoff

Keyword(s):

Electronics Packaging ◽

Packaging Design

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Subassemblies and Assemblies

Handbook Of Electronics Packaging Design and Engineering ◽

10.1007/978-94-011-7047-5_8 ◽

1990 ◽

pp. 177-196

Author(s):

Bernard S. Matisoff

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Formulas and Conversions

Handbook Of Electronics Packaging Design and Engineering ◽

10.1007/978-94-011-7047-5_22 ◽

1990 ◽

pp. 440-460

Author(s):

Bernard S. Matisoff

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Selection of Plastics for Various Environments

Handbook Of Electronics Packaging Design and Engineering ◽

10.1007/978-94-011-7047-5_20 ◽

1990 ◽

pp. 414-427

Author(s):

Bernard S. Matisoff

Keyword(s):

Selection Of

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Preferred Materials for Electronic Packaging

Handbook Of Electronics Packaging Design and Engineering ◽

10.1007/978-94-011-7047-5_19 ◽

1990 ◽

pp. 392-413

Author(s):

Bernard S. Matisoff

Keyword(s):

Electronic Packaging

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Human Factors Engineering

Handbook Of Electronics Packaging Design and Engineering ◽

10.1007/978-94-011-7047-5_3 ◽

1990 ◽

pp. 23-63

Author(s):

Bernard S. Matisoff

Keyword(s):

Human Factors ◽

Human Factors Engineering

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Slide-Mount Considerations for Electronic Assemblies

Handbook Of Electronics Packaging Design and Engineering ◽

10.1007/978-94-011-7047-5_24 ◽

1990 ◽

pp. 475-484

Author(s):

Bernard S. Matisoff

Keyword(s):

Electronic Assemblies

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Project Planning

Handbook Of Electronics Packaging Design and Engineering ◽

10.1007/978-94-011-7047-5_2 ◽

1990 ◽

pp. 6-22

Author(s):

Bernard S. Matisoff

Keyword(s):

Project Planning

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Handbook Of Electronics Packaging Design and EngineeringLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer Netherlands

Metal Alloy and Temper Designation Systems

Mechanics of Simple Stresses

Electronics Packaging Design and Engineering

Subassemblies and Assemblies

Formulas and Conversions

Selection of Plastics for Various Environments

Preferred Materials for Electronic Packaging

Human Factors Engineering

Slide-Mount Considerations for Electronic Assemblies

Project Planning

Handbook Of Electronics Packaging Design and Engineering
Latest Publications