Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging
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Published By WORLD SCIENTIFIC

9789814579780, 9789814579797

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A REVIEW OF COOLING ROAD MAPS FOR 3D CHIP PACKAGES

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789814579797_0001 ◽

2014 ◽

pp. 1-17

Author(s):

Dereje Agonafer

Keyword(s):

Road Maps

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SYNTHETIC JETS FOR HEAT TRANSFER AUGMENTATION IN MICROELECTRONICS SYSTEMS

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789814579797_0006 ◽

2014 ◽

pp. 125-165

Author(s):

Mehmet Arik ◽

Enes Tamdogan

Keyword(s):

Heat Transfer ◽

Synthetic Jets ◽

Heat Transfer Augmentation

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A CABINET LEVEL THERMAL TEST VEHICLE TO EVALUATE HYBRID DOUBLE-SIDED COOLING SCHEMES

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789814579797_0013 ◽

2014 ◽

pp. 333-356

Author(s):

Qihong Nie ◽

Yogendra Joshi

Keyword(s):

Test Vehicle ◽

Thermal Test

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OPTIMIZATION UNDER UNCERTAINTY FOR ELECTRONICS COOLING DESIGN

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789814579797_0011 ◽

2014 ◽

pp. 267-305

Author(s):

Karthik K. Bodla ◽

Jayathi Y. Murthy ◽

Suresh V. Garimella

Keyword(s):

Electronics Cooling ◽

Optimization Under Uncertainty ◽

Cooling Design

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FRONT MATTER

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789814579797_fmatter ◽

2014 ◽

pp. i-x

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ENERGY EFFICIENCY AND RELIABILITY RISK MITIGATION OF DATA CENTERS THROUGH PROGNOSTICS AND HEALTH MANAGEMENT

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789814579797_0014 ◽

2014 ◽

pp. 357-375

Author(s):

Jun Dai ◽

Michael Ohadi ◽

Michael Pecht

Keyword(s):

Energy Efficiency ◽

Data Centers ◽

Health Management ◽

Risk Mitigation ◽

Prognostics And Health Management ◽

Efficiency And Reliability

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AN OVERVIEW OF THE USE OF PHASE CHANGE MATERIALS FOR THE THERMAL MANAGEMENT OF TRANSIENT PORTABLE ELECTRONICS: BENEFITS AND CHALLENGES

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789814579797_0009 ◽

2014 ◽

pp. 227-241

Author(s):

Amy S. Fleischer

Keyword(s):

Phase Change ◽

Thermal Management ◽

Phase Change Materials ◽

Portable Electronics

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DAMAGE PRE-CURSORS BASED ASSESSMENT OF ACCRUED THERMO-MECHANICAL DAMAGE AND REMAINING USEFUL LIFE IN FIELD DEPLOYED ELECTRONICS

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789814579797_0015 ◽

2014 ◽

pp. 377-419

Author(s):

Pradeep Lall ◽

Mahendra Harsha ◽

Kai Goebel ◽

Jim Jones

Keyword(s):

Mechanical Damage ◽

Remaining Useful Life ◽

Useful Life

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OPTIMAL CHOICE OF HEAT SINKS FROM AN INDUSTRIAL POINT OF VIEW

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789814579797_0005 ◽

2014 ◽

pp. 83-123

Author(s):

Clemens J.M. Lasance

Keyword(s):

Optimal Choice ◽

Point Of View ◽

Heat Sinks

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DYNAMIC THERMAL MANAGEMENT CONSIDERING ACCURATE TEMPERATURE-LEAKAGE INTERDEPENDENCY

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789814579797_0003 ◽

2014 ◽

pp. 43-67 ◽

Cited By ~ 1

Author(s):

Bing Shi ◽

Ankur Srivastava

Keyword(s):

Thermal Management ◽

Dynamic Thermal Management ◽

Accurate Temperature

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Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By WORLD SCIENTIFIC

A REVIEW OF COOLING ROAD MAPS FOR 3D CHIP PACKAGES

SYNTHETIC JETS FOR HEAT TRANSFER AUGMENTATION IN MICROELECTRONICS SYSTEMS

A CABINET LEVEL THERMAL TEST VEHICLE TO EVALUATE HYBRID DOUBLE-SIDED COOLING SCHEMES

OPTIMIZATION UNDER UNCERTAINTY FOR ELECTRONICS COOLING DESIGN

FRONT MATTER

ENERGY EFFICIENCY AND RELIABILITY RISK MITIGATION OF DATA CENTERS THROUGH PROGNOSTICS AND HEALTH MANAGEMENT

AN OVERVIEW OF THE USE OF PHASE CHANGE MATERIALS FOR THE THERMAL MANAGEMENT OF TRANSIENT PORTABLE ELECTRONICS: BENEFITS AND CHALLENGES

DAMAGE PRE-CURSORS BASED ASSESSMENT OF ACCRUED THERMO-MECHANICAL DAMAGE AND REMAINING USEFUL LIFE IN FIELD DEPLOYED ELECTRONICS

OPTIMAL CHOICE OF HEAT SINKS FROM AN INDUSTRIAL POINT OF VIEW

DYNAMIC THERMAL MANAGEMENT CONSIDERING ACCURATE TEMPERATURE-LEAKAGE INTERDEPENDENCY

Cooling of Microelectronic and Nanoelectronic Equipment - WSPC Series in Advanced Integration and Packaging
Latest Publications