Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers
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Published By Springer International Publishing

9783030146894, 9783030146900

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Multi-chip Modules and Multi-chip Packaging

Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers ◽

10.1007/978-3-030-14690-0_7 ◽

2019 ◽

pp. 193-227

Author(s):

Mladen Božanić ◽

Saurabh Sinha

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Millimeter-Wave Research Challenges

Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers ◽

10.1007/978-3-030-14690-0_2 ◽

2019 ◽

pp. 31-53

Author(s):

Mladen Božanić ◽

Saurabh Sinha

Keyword(s):

Millimeter Wave ◽

Research Challenges ◽

Wave Research

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State-of-the-Art Approach: System-on-Package

Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers ◽

10.1007/978-3-030-14690-0_8 ◽

2019 ◽

pp. 229-271

Author(s):

Mladen Božanić ◽

Saurabh Sinha

Keyword(s):

State Of The Art

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Integrated Substrates: Millimeter-Wave Transistor Technologies

Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers ◽

10.1007/978-3-030-14690-0_4 ◽

2019 ◽

pp. 105-128

Author(s):

Mladen Božanić ◽

Saurabh Sinha

Keyword(s):

Millimeter Wave

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Discrete Substrates: Package Foundation

Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers ◽

10.1007/978-3-030-14690-0_5 ◽

2019 ◽

pp. 129-156

Author(s):

Mladen Božanić ◽

Saurabh Sinha

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Research Impact of System-Level Packaging for Millimeter-Wave Transceivers

Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers ◽

10.1007/978-3-030-14690-0_1 ◽

2019 ◽

pp. 1-29

Author(s):

Mladen Božanić ◽

Saurabh Sinha

Keyword(s):

Millimeter Wave ◽

Research Impact ◽

System Level

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Traditional Approach: System-on-Chip

Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers ◽

10.1007/978-3-030-14690-0_6 ◽

2019 ◽

pp. 157-191

Author(s):

Mladen Božanić ◽

Saurabh Sinha

Keyword(s):

Traditional Approach ◽

System On Chip ◽

On Chip

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Behavior of Active and Passive Devices at Millimeter-Wave Frequencies

Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers ◽

10.1007/978-3-030-14690-0_3 ◽

2019 ◽

pp. 55-104

Author(s):

Mladen Božanić ◽

Saurabh Sinha

Keyword(s):

Millimeter Wave ◽

Passive Devices

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Assessment of Completed Work and Future Directions in Millimeter-Wave Research

Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers ◽

10.1007/978-3-030-14690-0_9 ◽

2019 ◽

pp. 273-277

Author(s):

Mladen Božanić ◽

Saurabh Sinha

Keyword(s):

Millimeter Wave ◽

Future Directions ◽

Wave Research

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Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave TransceiversLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer International Publishing

Multi-chip Modules and Multi-chip Packaging

Millimeter-Wave Research Challenges

State-of-the-Art Approach: System-on-Package

Integrated Substrates: Millimeter-Wave Transistor Technologies

Discrete Substrates: Package Foundation

Research Impact of System-Level Packaging for Millimeter-Wave Transceivers

Traditional Approach: System-on-Chip

Behavior of Active and Passive Devices at Millimeter-Wave Frequencies

Assessment of Completed Work and Future Directions in Millimeter-Wave Research

Smart Sensors, Measurement and Instrumentation - Systems-Level Packaging for Millimeter-Wave Transceivers
Latest Publications