2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160)
Latest Publications

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A process control strategy based upon device performance metrics

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160) ◽

10.1109/asmc.2001.925613 ◽

2002 ◽

Author(s):

S. Ruegsegger ◽

B. Conchieri

Keyword(s):

Process Control ◽

Control Strategy ◽

Performance Metrics ◽

Device Performance

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The application and validation of a new robust windowing method for the Poisson yield model

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160) ◽

10.1109/asmc.2001.925640 ◽

2002 ◽

Cited By ~ 3

Author(s):

R.E. Langford ◽

J.J. Liou ◽

V. Raghavan

Keyword(s):

Yield Model ◽

Poisson Yield Model

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Cost reduction using systematic target setting of the reference fab methodology

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160) ◽

10.1109/asmc.2001.925607 ◽

2002 ◽

Cited By ~ 2

Author(s):

R. Plieninger ◽

U. Muller ◽

H. Ehm ◽

W. Reczek

Keyword(s):

Cost Reduction ◽

Target Setting

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Non-contact wafer handling using high-intensity ultrasonics

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160) ◽

10.1109/asmc.2001.925636 ◽

2002 ◽

Cited By ~ 6

Author(s):

G. Reinhart ◽

J. Hoeppner ◽

J. Zimmermann

Keyword(s):

High Intensity

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Chemical supplier quality management: the changes and challenges

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160) ◽

10.1109/asmc.2001.925637 ◽

2002 ◽

Author(s):

J. O'Brien ◽

T. Leslie

Keyword(s):

Quality Management ◽

Supplier Quality Management

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Capacity analysis tool

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160) ◽

10.1109/asmc.2001.925620 ◽

2002 ◽

Author(s):

S. Sisler ◽

E. Merrill ◽

P. Sorrentino

Keyword(s):

Capacity Analysis ◽

Analysis Tool

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Raman spectroscopy, high pressure phosphine anneal, and the electrical properties of the DRAM capacitor

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160) ◽

10.1109/asmc.2001.925624 ◽

2002 ◽

Author(s):

S. Sawaya

Keyword(s):

Raman Spectroscopy ◽

High Pressure ◽

Electrical Properties

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Automated photolithography critical dimension controls in a complex, mixed technology, manufacturing fab

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160) ◽

10.1109/asmc.2001.925612 ◽

2002 ◽

Cited By ~ 3

Author(s):

C. Schneider ◽

J. Smyth ◽

A. Watts

Keyword(s):

Critical Dimension

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Modular silicon-on-insulator process for power devices and power integrated circuits

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160) ◽

10.1109/asmc.2001.925617 ◽

2002 ◽

Author(s):

R.P. Zingg ◽

R. Bonne

Keyword(s):

Integrated Circuits ◽

Silicon On Insulator ◽

Power Devices

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In-situ plasma etch process endpoint control in integrated circuit manufacturing

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160) ◽

10.1109/asmc.2001.925615 ◽

2002 ◽

Cited By ~ 2

Author(s):

T. Reis

Keyword(s):

Integrated Circuit ◽

Plasma Etch ◽

Integrated Circuit Manufacturing ◽

Endpoint Control

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2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A process control strategy based upon device performance metrics

The application and validation of a new robust windowing method for the Poisson yield model

Cost reduction using systematic target setting of the reference fab methodology

Non-contact wafer handling using high-intensity ultrasonics

Chemical supplier quality management: the changes and challenges

Capacity analysis tool

Raman spectroscopy, high pressure phosphine anneal, and the electrical properties of the DRAM capacitor

Automated photolithography critical dimension controls in a complex, mixed technology, manufacturing fab

Modular silicon-on-insulator process for power devices and power integrated circuits

In-situ plasma etch process endpoint control in integrated circuit manufacturing

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160)
Latest Publications