Thermal Management of Electronic Systems II
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TOTAL DOCUMENTS

34

(FIVE YEARS 0)

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4

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Published By Springer Netherlands

9789401063180, 9789401155069

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Electrothermal Simulation of Analogue Integrated Circuits With Ets

Thermal Management of Electronic Systems II ◽

10.1007/978-94-011-5506-9_8 ◽

1997 ◽

pp. 83-92 ◽

Cited By ~ 1

Author(s):

W. van Petegem ◽

B. Geeraerts ◽

W. Sansen

Keyword(s):

Integrated Circuits ◽

Analogue Integrated Circuits ◽

Electrothermal Simulation

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Thermal and Thermo-Mechanical Evaluation of a ‘Chip in Moulded Interconnect Device’

Thermal Management of Electronic Systems II ◽

10.1007/978-94-011-5506-9_33 ◽

1997 ◽

pp. 339-348 ◽

Cited By ~ 1

Author(s):

F. Christiaens ◽

E. Beyne ◽

J. Roggen ◽

J. van Puymbroeck ◽

M. Heerman

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Thermal and Thermomechanical Modelling of Ball Grid Array Packages

Thermal Management of Electronic Systems II ◽

10.1007/978-94-011-5506-9_32 ◽

1997 ◽

pp. 329-338

Author(s):

Thierry Fromont

Keyword(s):

Ball Grid Array ◽

Ball Grid Array Packages

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Natural Convection Experiments With Cuboids and Cylinders of Equal Area

Thermal Management of Electronic Systems II ◽

10.1007/978-94-011-5506-9_25 ◽

1997 ◽

pp. 263-272

Author(s):

R. A. van Es ◽

R. M. Noort ◽

C. J. M. Lasance

Keyword(s):

Natural Convection ◽

Equal Area

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An Interactive Thermal Characterization of Component Placement

Thermal Management of Electronic Systems II ◽

10.1007/978-94-011-5506-9_10 ◽

1997 ◽

pp. 103-111

Author(s):

J. L. Blanchard ◽

S. Louage

Keyword(s):

Thermal Characterization ◽

Component Placement

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Analysis of 3D Conjugate Heat Transfer in Electronic Boards: Interaction Between Three Integrated Circuits

Thermal Management of Electronic Systems II ◽

10.1007/978-94-011-5506-9_6 ◽

1997 ◽

pp. 63-72

Author(s):

B. Fourka ◽

J. B. Saulnier

Keyword(s):

Heat Transfer ◽

Integrated Circuits ◽

Conjugate Heat Transfer

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Experimental Study on Local Convective Heat Transfer from a Protruding Cubical Component

Thermal Management of Electronic Systems II ◽

10.1007/978-94-011-5506-9_29 ◽

1997 ◽

pp. 301-308

Author(s):

E. R. Meinders ◽

T. H. Vd Meer ◽

C. J. Hoogendoorn ◽

C. J. M. Lasance

Keyword(s):

Heat Transfer ◽

Experimental Study ◽

Convective Heat Transfer ◽

Convective Heat

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Visualization of Natural Convection in Inclined Heated Parallel Plates

Thermal Management of Electronic Systems II ◽

10.1007/978-94-011-5506-9_27 ◽

1997 ◽

pp. 283-292 ◽

Cited By ~ 2

Author(s):

Oronzio Manca ◽

Biagio Morrone ◽

Sergio Nardini

Keyword(s):

Natural Convection ◽

Parallel Plates

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Characterisation of Thermally Enhanced Plastic Packages

Thermal Management of Electronic Systems II ◽

10.1007/978-94-011-5506-9_15 ◽

1997 ◽

pp. 159-166

Author(s):

Are Bjorneklett ◽

Gunnar Gustavsson

Keyword(s):

Plastic Packages

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Experimental Validation Methods for Thermal Models

Thermal Management of Electronic Systems II ◽

10.1007/978-94-011-5506-9_12 ◽

1997 ◽

pp. 125-136 ◽

Cited By ~ 2

Author(s):

W. Temmerman ◽

W. Nelemans ◽

T. Goossens ◽

E. Lauwers ◽

C. Lacaze

Keyword(s):

Experimental Validation ◽

Thermal Models ◽

Validation Methods

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