Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97
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Eutectic solder bump process for ULSI flip chip technology

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626934 ◽

2002 ◽

Cited By ~ 4

Author(s):

H. Ezawa ◽

M. Miyata ◽

H. Inoue

Keyword(s):

Flip Chip ◽

Solder Bump ◽

Eutectic Solder ◽

Chip Technology

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Lifetime assessment of soft solder joints on the base of the metallurgical behaviour of Sn/sub 62/Pb/sub 36/Ag/sub 2/

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626927 ◽

2002 ◽

Author(s):

G. Grossmann ◽

L. Weber

Keyword(s):

Solder Joints

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Assessment of failure rate of printed board assemblies by the high temperature accelerated life test

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626864 ◽

2002 ◽

Author(s):

Choong-Reol Young ◽

Jae-Nyun Yoo

Keyword(s):

High Temperature ◽

Failure Rate ◽

Accelerated Life Test ◽

Life Test ◽

Accelerated Life

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A study of wafer fab dispatching rules based on empirical flow time predictions

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626957 ◽

2002 ◽

Author(s):

Yi-Feng Hung ◽

Ching-Bin Chang

Keyword(s):

Flow Time ◽

Dispatching Rules ◽

Wafer Fab

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Product-oriented BGA manufacturability and reliability study

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626944 ◽

2002 ◽

Author(s):

B. Oberlin ◽

T. Chung

Keyword(s):

Reliability Study

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Beyond refractive optical lithography next generation lithography "What's after 193 nm?"

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626940 ◽

2002 ◽

Cited By ~ 1

Author(s):

P. Seidel ◽

J. Canning ◽

S. Mackay

Keyword(s):

Optical Lithography ◽

Next Generation ◽

193 Nm ◽

Next Generation Lithography

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An experimental study on organic solderability preservative

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626876 ◽

2002 ◽

Cited By ~ 1

Author(s):

Yuan Li

Keyword(s):

Experimental Study ◽

Organic Solderability Preservative

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A fracture mechanics analysis of the popcorn cracking in the plastic IC packages

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626866 ◽

2002 ◽

Cited By ~ 7

Author(s):

Y.B. Park ◽

Jin Yu

Keyword(s):

Fracture Mechanics ◽

Mechanics Analysis

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Cost analysis of chip scale packaging

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626921 ◽

2002 ◽

Author(s):

Lo-Soun Su ◽

M. Louis ◽

C. Reber

Keyword(s):

Cost Analysis

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Significance of coating stress on substrate bow in large area processing of MCM

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626902 ◽

2002 ◽

Author(s):

Kwanho Yang ◽

Jang-Hi Im ◽

R.H. Heistand

Keyword(s):

Large Area ◽

Coating Stress

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Eutectic solder bump process for ULSI flip chip technology

Lifetime assessment of soft solder joints on the base of the metallurgical behaviour of Sn/sub 62/Pb/sub 36/Ag/sub 2/

Assessment of failure rate of printed board assemblies by the high temperature accelerated life test

A study of wafer fab dispatching rules based on empirical flow time predictions

Product-oriented BGA manufacturability and reliability study

Beyond refractive optical lithography next generation lithography "What's after 193 nm?"

An experimental study on organic solderability preservative

A fracture mechanics analysis of the popcorn cracking in the plastic IC packages

Cost analysis of chip scale packaging

Significance of coating stress on substrate bow in large area processing of MCM

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97
Latest Publications