ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference
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Published By IEEE

9781467350075, 9781467350068

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Recent advances in memory technology

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2013.6552766 ◽

2013 ◽

Cited By ~ 2

Author(s):

Dick James

Keyword(s):

Recent Advances

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Metrology and inspection challenges for manufacturing 3D stacked IC's

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2013.6552779 ◽

2013 ◽

Cited By ~ 1

Author(s):

Sandip Halder ◽

Karen Stiers ◽

Andy Miller ◽

Ingrid de Wolf ◽

Alain Phommahaxay ◽

...

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Cost effective application of advanced computational lithography techniques using flexible mask optimization

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2013.6552743 ◽

2013 ◽

Cited By ~ 3

Author(s):

Gek Soon Chua ◽

Russell Dover ◽

Xiaolong Zhang ◽

Bo Yan ◽

Yi Zou ◽

...

Keyword(s):

Cost Effective ◽

Effective Application

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Full wafer nanotopography analysis on rough surfaces using stitched white light interferometry images

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2013.6552812 ◽

2013 ◽

Cited By ~ 2

Author(s):

Dirk Lewke ◽

Martin Schellenberger ◽

Lothar Pfitzner ◽

Thomas Fries ◽

Bastian Troger ◽

...

Keyword(s):

White Light ◽

Rough Surfaces ◽

White Light Interferometry

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An effective problem decomposition method for scheduling of diffusion processes based on mixed integer linear programming

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2013.6552771 ◽

2013 ◽

Author(s):

Chihyun Jung ◽

Detlef Pabst ◽

Myoungsoo Ham ◽

Marcel Stehli ◽

Marcel Rothe

Keyword(s):

Linear Programming ◽

Integer Linear Programming ◽

Mixed Integer Linear Programming ◽

Decomposition Method ◽

Diffusion Processes ◽

Mixed Integer ◽

Problem Decomposition ◽

Effective Problem

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Case studies of fault isolation for the global failing patterns on SRAM bitmap caused by the defects in peripheral logic regions

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2013.6552809 ◽

2013 ◽

Cited By ~ 1

Author(s):

Jianhua Yin ◽

Jian Yu ◽

Sheng Xie ◽

Dapeng Sun ◽

Yong Ern Ling ◽

...

Keyword(s):

Case Studies ◽

Fault Isolation

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ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2013.6552742 ◽

2013 ◽

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Defect reduction by nitrogen purge of wafer carriers

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2013.6552756 ◽

2013 ◽

Author(s):

R. van Roijen ◽

P. Joshi ◽

D. Bailey ◽

S. Conti ◽

W. Brennan ◽

...

Keyword(s):

Defect Reduction

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Purging of foup for 450 mm wafer manufacturing

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2013.6552791 ◽

2013 ◽

Cited By ~ 1

Author(s):

Chun-Yong Khoo ◽

Shih-Cheng Hu ◽

Che-Yu Huang ◽

Cheng-Wei Yang ◽

Bill Chiu ◽

...

Keyword(s):

Wafer Manufacturing

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Maintaining abatement efficiency while increasing utility efficiency using the applied iSYS™ controller

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2013.6552787 ◽

2013 ◽

Cited By ~ 2

Author(s):

Monique McIntosh

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ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Recent advances in memory technology

Metrology and inspection challenges for manufacturing 3D stacked IC's

Cost effective application of advanced computational lithography techniques using flexible mask optimization

Full wafer nanotopography analysis on rough surfaces using stitched white light interferometry images

An effective problem decomposition method for scheduling of diffusion processes based on mixed integer linear programming

Case studies of fault isolation for the global failing patterns on SRAM bitmap caused by the defects in peripheral logic regions

Table of contents

Defect reduction by nitrogen purge of wafer carriers

Purging of foup for 450 mm wafer manufacturing

Maintaining abatement efficiency while increasing utility efficiency using the applied iSYS™ controller

Export Citation Format

ASMC 2013 SEMI Advanced Semiconductor Manufacturing ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Recent advances in memory technology

Metrology and inspection challenges for manufacturing 3D stacked IC's

Cost effective application of advanced computational lithography techniques using flexible mask optimization

Full wafer nanotopography analysis on rough surfaces using stitched white light interferometry images

An effective problem decomposition method for scheduling of diffusion processes based on mixed integer linear programming

Case studies of fault isolation for the global failing patterns on SRAM bitmap caused by the defects in peripheral logic regions

Table of contents

Defect reduction by nitrogen purge of wafer carriers

Purging of foup for 450 mm wafer manufacturing

Maintaining abatement efficiency while increasing utility efficiency using the applied iSYS™ controller

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference
Latest Publications