Thermal Management of Electronic Systems
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Published By Springer Netherlands

9789401044721, 9789401110822

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Differences between 2D and 3D models predictions in a channel with a dissipating obstacle

Thermal Management of Electronic Systems ◽

10.1007/978-94-011-1082-2_9 ◽

1994 ◽

pp. 107-116 ◽

Cited By ~ 1

Author(s):

J. B. Saulnier ◽

H. Y. Wang ◽

B. Fourka

Keyword(s):

3D Models ◽

2D And 3D

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Natural Convection in a rectangular Enclosure with an Array of Chips Mounted on a Vertical Wall

Thermal Management of Electronic Systems ◽

10.1007/978-94-011-1082-2_8 ◽

1994 ◽

pp. 97-106

Author(s):

C. Di Perna ◽

A. Evangelisti ◽

M. Paroncini ◽

R. Ricci

Keyword(s):

Natural Convection ◽

Vertical Wall ◽

Rectangular Enclosure

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Two complementary approaches for the thermal simulation of electronic equipment

Thermal Management of Electronic Systems ◽

10.1007/978-94-011-1082-2_6 ◽

1994 ◽

pp. 75-84

Author(s):

J. L. Blanchard ◽

J. M. Morelle

Keyword(s):

Thermal Simulation ◽

Electronic Equipment

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Application and Performance of Si-Microcooling Systems for Electronic Devices

Thermal Management of Electronic Systems ◽

10.1007/978-94-011-1082-2_20 ◽

1994 ◽

pp. 223-232 ◽

Cited By ~ 1

Author(s):

Bernd Gromoll

Keyword(s):

Electronic Devices ◽

And Performance

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Pool boiling heat transfer of dielectric fluids for immersion electronic cooling: effects of pressure

Thermal Management of Electronic Systems ◽

10.1007/978-94-011-1082-2_22 ◽

1994 ◽

pp. 243-253 ◽

Cited By ~ 3

Author(s):

G. Guglielmini ◽

M. Misale ◽

C. Schenone

Keyword(s):

Heat Transfer ◽

Boiling Heat Transfer ◽

Pool Boiling ◽

Electronic Cooling ◽

Pool Boiling Heat Transfer ◽

Dielectric Fluids ◽

Cooling Effects

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Thermal characterization and design for high performance multichip module type laminate

Thermal Management of Electronic Systems ◽

10.1007/978-94-011-1082-2_25 ◽

1994 ◽

pp. 277-286

Author(s):

E. Lauwers ◽

A. Ackaert ◽

K. Allaert ◽

W. Temmerman ◽

W. Nelemans ◽

...

Keyword(s):

High Performance ◽

Thermal Characterization ◽

Multichip Module ◽

Module Type

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Computer-Aided Optimization of Electrothermal CMOS-Compatible Infrared Sensors

Thermal Management of Electronic Systems ◽

10.1007/978-94-011-1082-2_12 ◽

1994 ◽

pp. 139-148 ◽

Cited By ~ 1

Author(s):

G. Wachutka ◽

J. Funk ◽

H. Baltes

Keyword(s):

Infrared Sensors ◽

Computer Aided ◽

Cmos Compatible

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Thermal Management of Air-Cooled Electronic Systems: New Challenges for Research

Thermal Management of Electronic Systems ◽

10.1007/978-94-011-1082-2_1 ◽

1994 ◽

pp. 3-24 ◽

Cited By ~ 9

Author(s):

C. J. M. Lasance

Keyword(s):

Thermal Management ◽

Electronic Systems ◽

New Challenges

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Impact of Die Attach Defects on Internal Temperature of Power Hybrids

Thermal Management of Electronic Systems ◽

10.1007/978-94-011-1082-2_29 ◽

1994 ◽

pp. 325-334

Author(s):

F. Michard ◽

J. M. Dupont ◽

H. Ribot ◽

M. Salagoity

Keyword(s):

Internal Temperature ◽

Die Attach

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Investigation of Die Attach Integrity Using Transient Thermal Analysis Techniques

Thermal Management of Electronic Systems ◽

10.1007/978-94-011-1082-2_27 ◽

1994 ◽

pp. 297-306 ◽

Cited By ~ 5

Author(s):

Daguang Liu ◽

John Barrett ◽

Séan Cian Ó Mathúna

Keyword(s):

Thermal Analysis ◽

Transient Thermal Analysis ◽

Analysis Techniques ◽

Die Attach ◽

Thermal Analysis Techniques ◽

Transient Thermal

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Thermal Management of Electronic SystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer Netherlands

Differences between 2D and 3D models predictions in a channel with a dissipating obstacle

Natural Convection in a rectangular Enclosure with an Array of Chips Mounted on a Vertical Wall

Two complementary approaches for the thermal simulation of electronic equipment

Application and Performance of Si-Microcooling Systems for Electronic Devices

Pool boiling heat transfer of dielectric fluids for immersion electronic cooling: effects of pressure

Thermal characterization and design for high performance multichip module type laminate

Computer-Aided Optimization of Electrothermal CMOS-Compatible Infrared Sensors

Thermal Management of Air-Cooled Electronic Systems: New Challenges for Research

Impact of Die Attach Defects on Internal Temperature of Power Hybrids

Investigation of Die Attach Integrity Using Transient Thermal Analysis Techniques

Thermal Management of Electronic Systems
Latest Publications