Proceedings 1997 IEEE Multi-Chip Module Conference
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Low cost test of MCMs using testable die carriers

Proceedings 1997 IEEE Multi-Chip Module Conference ◽

10.1109/mcmc.1997.569359 ◽

2002 ◽

Author(s):

K. Sasidhar ◽

A. Chatterjee ◽

M. Tswaminathan

Keyword(s):

Low Cost

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A new timing-driven multilayer MCM/IC routing algorithm

Proceedings 1997 IEEE Multi-Chip Module Conference ◽

10.1109/mcmc.1997.569350 ◽

2002 ◽

Cited By ~ 9

Author(s):

Dongsheng Wang ◽

E.S. Kuh

Keyword(s):

Routing Algorithm

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High Q inductors for MCM-Si technology

Proceedings 1997 IEEE Multi-Chip Module Conference ◽

10.1109/mcmc.1997.569342 ◽

2002 ◽

Cited By ~ 7

Author(s):

N. Klemmer ◽

J. Hartung

Keyword(s):

High Q

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Precision embedded thin film resistors for multichip modules (MCM-D)

Proceedings 1997 IEEE Multi-Chip Module Conference ◽

10.1109/mcmc.1997.569344 ◽

2002 ◽

Cited By ~ 1

Author(s):

Chang-Ming Lin ◽

E.A. Logan ◽

D. Tuckerman

Keyword(s):

Thin Film ◽

Multichip Modules ◽

Thin Film Resistors

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Wire length and width bound generation for high-speed MCM and PCB designs

Proceedings 1997 IEEE Multi-Chip Module Conference ◽

10.1109/mcmc.1997.569346 ◽

2002 ◽

Author(s):

Haizhou Chen ◽

E. Shragowitz ◽

Jaebum Lee

Keyword(s):

High Speed ◽

Wire Length

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A flip-chip implementation of the Data Encryption Standard (DES)

Proceedings 1997 IEEE Multi-Chip Module Conference ◽

10.1109/mcmc.1997.569339 ◽

2002 ◽

Cited By ~ 8

Author(s):

T. Schaffer ◽

A. Glaser ◽

S. Rao ◽

P. Franzon

Keyword(s):

Flip Chip ◽

Data Encryption ◽

Data Encryption Standard

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Area I/O flip-chip packaging to minimize interconnect length

Proceedings 1997 IEEE Multi-Chip Module Conference ◽

10.1109/mcmc.1997.569337 ◽

2002 ◽

Cited By ~ 7

Author(s):

R.J. Lomax ◽

R.B. Brown ◽

M. Nanua ◽

T.D. Strong

Keyword(s):

Flip Chip ◽

Flip Chip Packaging

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An adaptive wide-area design process manager for collaborative multichip module design

Proceedings 1997 IEEE Multi-Chip Module Conference ◽

10.1109/mcmc.1997.569347 ◽

2002 ◽

Cited By ~ 1

Author(s):

A.M. Madni ◽

C.C. Madni

Keyword(s):

Design Process ◽

Wide Area ◽

Multichip Module ◽

Module Design

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Strategies and structures for test access in mixed-signal MCMs

Proceedings 1997 IEEE Multi-Chip Module Conference ◽

10.1109/mcmc.1997.569360 ◽

2002 ◽

Author(s):

M. Katoozi ◽

H. Kutz ◽

M. Soma ◽

S. Huynh

Keyword(s):

Mixed Signal

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High speed I/O buffer design for MCM

Proceedings 1997 IEEE Multi-Chip Module Conference ◽

10.1109/mcmc.1997.569345 ◽

2002 ◽

Cited By ~ 4

Author(s):

S.J. Yang ◽

T.C. Chang ◽

Ruey-Wen Chien ◽

E.D. Wang ◽

T.J. Gabara ◽

...

Keyword(s):

High Speed ◽

Buffer Design

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Proceedings 1997 IEEE Multi-Chip Module ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Low cost test of MCMs using testable die carriers

A new timing-driven multilayer MCM/IC routing algorithm

High Q inductors for MCM-Si technology

Precision embedded thin film resistors for multichip modules (MCM-D)

Wire length and width bound generation for high-speed MCM and PCB designs

A flip-chip implementation of the Data Encryption Standard (DES)

Area I/O flip-chip packaging to minimize interconnect length

An adaptive wide-area design process manager for collaborative multichip module design

Strategies and structures for test access in mixed-signal MCMs

High speed I/O buffer design for MCM

Proceedings 1997 IEEE Multi-Chip Module Conference
Latest Publications