2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications

TOTAL DOCUMENTS

129

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781479977277

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A new MHC catalyst system — Nano-Silver

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048362 ◽

2014 ◽

Cited By ~ 1

Author(s):

Wenjia Zhou ◽

Suk-Kwan Kwong ◽

Chit-Yiu Chan ◽

Kwok-Wai Yee

Keyword(s):

Catalyst System ◽

Nano Silver

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Adhesive enabling technology for directly plating copper onto glass

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048460 ◽

2014 ◽

Cited By ~ 1

Author(s):

Kenichiroh Mukai ◽

Tafadzwa Magaya ◽

Lutz Brandt ◽

Zhiming Liu ◽

Hailuo Fu ◽

...

Keyword(s):

Enabling Technology

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A new surface finish for the electronics industry: Electroless nickel/immersion silver

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048458 ◽

2014 ◽

Cited By ~ 2

Author(s):

Lenora M. Toscano ◽

Ernest Long

Keyword(s):

Surface Finish ◽

Electroless Nickel ◽

Electronics Industry ◽

Immersion Silver

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The failure behavior of the fine pitch SnAg bump under current stressing

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048440 ◽

2014 ◽

Author(s):

Yu-Hsiu Shao ◽

Ying-Ta Chiu ◽

Chin-Lin Kao ◽

Ping-Feng Yang

Keyword(s):

Failure Behavior ◽

Current Stressing ◽

Fine Pitch

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Design, simulation and fabrication of MEMS Lorentz force sensor

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048430 ◽

2014 ◽

Author(s):

Chung-Yang Sue ◽

Sheng-Ren Chiu ◽

Chun-Yin Tsai ◽

Shi Chen ◽

Chin-Fu Kuo ◽

...

Keyword(s):

Lorentz Force ◽

Force Sensor

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The optimization of Free Air Ball for Ag alloy wire bonding (IMPACT 2014)

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048405 ◽

2014 ◽

Author(s):

Louis Chen ◽

Frank Huang ◽

Hsiu Chun Li ◽

W C Hsu

Keyword(s):

Wire Bonding ◽

Alloy Wire ◽

Free Air

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The reduction of switching VR impact on PCB signals

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048365 ◽

2014 ◽

Cited By ~ 1

Author(s):

Yinglei Ren ◽

Wei Shen ◽

Patt Chang ◽

Y L Li

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Electroplated copper filling of through holes on varying substrate thickness

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048462 ◽

2014 ◽

Cited By ~ 1

Author(s):

Kesheng Feng ◽

Bill DeCesare ◽

Mike Yu ◽

Don DeSalvo ◽

Jim Watkowski

Keyword(s):

Substrate Thickness ◽

Electroplated Copper

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Thermal-moisture coupling effects on PA and UF warpage stress of 2.5D IC package by FE simulation analysis

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048443 ◽

2014 ◽

Cited By ~ 3

Author(s):

M. H. Wang ◽

C. T. Wang ◽

C. P. Hung ◽

P. F. Yang ◽

C. C. Lee ◽

...

Keyword(s):

Fe Simulation ◽

Simulation Analysis ◽

Coupling Effects ◽

Ic Package

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LED flip chip packaging trends with tear down study

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048358 ◽

2014 ◽

Author(s):

T. Onishi

Keyword(s):

Flip Chip ◽

Flip Chip Packaging

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2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A new MHC catalyst system — Nano-Silver

Adhesive enabling technology for directly plating copper onto glass

A new surface finish for the electronics industry: Electroless nickel/immersion silver

The failure behavior of the fine pitch SnAg bump under current stressing

Design, simulation and fabrication of MEMS Lorentz force sensor

The optimization of Free Air Ball for Ag alloy wire bonding (IMPACT 2014)

The reduction of switching VR impact on PCB signals

Electroplated copper filling of through holes on varying substrate thickness

Thermal-moisture coupling effects on PA and UF warpage stress of 2.5D IC package by FE simulation analysis

LED flip chip packaging trends with tear down study

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications