Fundamentals of Lead-Free Solder Interconnect Technology
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Published By Springer US

9781461492658, 9781461492665
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Challenges in Future-Generation Interconnects: Microstructure Again

2014 ◽  
pp. 231-249
Author(s):  
Tae-Kyu Lee ◽  
Thomas R. Bieler ◽  
Choong-Un Kim ◽  
Hongtao Ma
Keyword(s):  
Future Generation

Interconnection: The Joint

2014 ◽  
pp. 21-50 ◽  
Author(s):  
Tae-Kyu Lee ◽  
Thomas R. Bieler ◽  
Choong-Un Kim ◽  
Hongtao Ma

Microstructure Development: Solidification and Isothermal Aging

2014 ◽  
pp. 81-112 ◽  
Author(s):  
Tae-Kyu Lee ◽  
Thomas R. Bieler ◽  
Choong-Un Kim ◽  
Hongtao Ma
Keyword(s):  
Isothermal Aging ◽  
Microstructure Development

Mechanical Stability and Performance

2014 ◽  
pp. 169-210 ◽  
Author(s):  
Tae-Kyu Lee ◽  
Thomas R. Bieler ◽  
Choong-Un Kim ◽  
Hongtao Ma
Keyword(s):  
Mechanical Stability ◽  
And Performance

Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys

2014 ◽  
pp. 51-80
Author(s):  
Tae-Kyu Lee ◽  
Thomas R. Bieler ◽  
Choong-Un Kim ◽  
Hongtao Ma
Keyword(s):  
Phase Equilibria ◽  
Cu Alloys

Introduction

2014 ◽  
pp. 1-20
Author(s):  
Tae-Kyu Lee ◽  
Thomas R. Bieler ◽  
Choong-Un Kim ◽  
Hongtao Ma

Chemical and Environmental Attack

2014 ◽  
pp. 211-230
Author(s):  
Tae-Kyu Lee ◽  
Thomas R. Bieler ◽  
Choong-Un Kim ◽  
Hongtao Ma
Keyword(s):  
Environmental Attack

Thermal Cycling Performance

2014 ◽  
pp. 113-168
Author(s):  
Tae-Kyu Lee ◽  
Thomas R. Bieler ◽  
Choong-Un Kim ◽  
Hongtao Ma
Keyword(s):  
Thermal Cycling ◽  
Cycling Performance
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