2018 13th International Congress Molded Interconnect Devices (MID)
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9781538649336
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Low-Temperature Sintering of Nanometal Inks on Polymer Substrates

2018 ◽  
Author(s):  
Jurgen Keck ◽  
Birger Freisinger ◽  
Daniel Juric ◽  
Kerstin Glaser ◽  
Martin Volker ◽  
...  
Keyword(s):  
Low Temperature ◽  
Low Temperature Sintering ◽  
Polymer Substrates

Long-Term Behavior of SMT Components Mounted on Printed Polymer Thick Film Pastes

2018 ◽  
Author(s):  
Julian Schirmer ◽  
Kilian Eisen ◽  
Marcus Reichenberger ◽  
Jewgeni Roudenko ◽  
Simone Neermann ◽  
...  
Keyword(s):  
Thick Film ◽  
Long Term Behavior

Optimized Thermoforming Process for Conformable Electronics

2018 ◽  
Author(s):  
Christine Kallmayer ◽  
Florian Schaller ◽  
Thomas Loher ◽  
Julian Haberland ◽  
Fabian Kayatz ◽  
...  
Keyword(s):  
Thermoforming Process

Limits of ceramics in the 3D-MID with additively produced aluminum substrate

2018 ◽  
Author(s):  
Elisa Gotze ◽  
Kevin Postler ◽  
Stefan Buschulte ◽  
Frederik Zanger ◽  
Volker Schulze
Keyword(s):  
Aluminum Substrate

scholarly journals The Potential of 3D-MID Technology for Omnidirectional Inductive Wireless Power Transfer

2018 ◽  
Author(s):  
Kamotesov Sergkei ◽  
Philippe Lombard ◽  
Vincent Semet ◽  
Bruno Allard ◽  
Mael Moguedet ◽  
...  
Keyword(s):  
Wireless Power Transfer ◽  
Power Transfer ◽  
Wireless Power
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