2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Latest Publications

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9781728161617

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High-Dimensional Uncertainty Quantification via Active and Rank-Adaptive Tensor Regression

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps48591.2020.9231388 ◽

2020 ◽

Author(s):

Zichang He ◽

Zheng Zhang

Keyword(s):

Uncertainty Quantification ◽

High Dimensional ◽

Tensor Regression

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Gauss-Newton Method for Performance Evaluation of Decoupling Capacitors on Resonant Parallel Plates

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps48591.2020.9231364 ◽

2020 ◽

Author(s):

Ihsan Erdin ◽

Ram Achar

Keyword(s):

Performance Evaluation ◽

Newton Method ◽

Parallel Plates ◽

Decoupling Capacitors

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Reinforcement Learning-based Auto-router considering Signal Integrity

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps48591.2020.9231473 ◽

2020 ◽

Author(s):

Minsu Kim ◽

Hyunwook Park ◽

Seongguk Kim ◽

Keeyoung Son ◽

Subin Kim ◽

...

Keyword(s):

Reinforcement Learning ◽

Signal Integrity

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Determine Socket’s Inductance and Contact Resistance by Using PRF Method

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps48591.2020.9231502 ◽

2020 ◽

Author(s):

Tao Wang ◽

Jun Fan

Keyword(s):

Contact Resistance

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Variational Inference approach to Jitter decomposition in High-speed Link

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps48591.2020.9231487 ◽

2020 ◽

Author(s):

Bobi Shi ◽

Thong Nguyen ◽

Jose Schutt-Aine

Keyword(s):

High Speed ◽

Variational Inference

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ANN Performance for the Prediction of High-Speed Digital Interconnects over Multiple PCBs

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps48591.2020.9231490 ◽

2020 ◽

Author(s):

Katharina Scharff ◽

Christian Morten Schierholz ◽

Cheng Yang ◽

Christian Schuster

Keyword(s):

High Speed

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PCIe Gen-5 Design Challenges of High-Speed Servers

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps48591.2020.9231458 ◽

2020 ◽

Author(s):

Mallikarjun Vasa ◽

Chun-Lin Liao ◽

Sanjay Kumar ◽

Ching-Huei Chen ◽

Bhyrav Mutnury

Keyword(s):

High Speed ◽

Design Challenges

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On Dissipativity Conditions for Linearized Models of Locally Active Circuit Blocks

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps48591.2020.9231316 ◽

2020 ◽

Author(s):

T. Bradde ◽

S. Grivet-Talocia ◽

G. C. Calafiore ◽

A. V. Proskurnikov ◽

Z. Mahmood ◽

...

Keyword(s):

Active Circuit ◽

Circuit Blocks

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Thermal Sensitivity of Dielectric Materials in High-Speed Designs

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps48591.2020.9231336 ◽

2020 ◽

Author(s):

Sunil Pathania ◽

Bhyrav Mutnury ◽

Mallikarjun Vasa ◽

Vijender Kumar ◽

Sukumar Muthusamy ◽

...

Keyword(s):

High Speed ◽

Thermal Sensitivity ◽

Dielectric Materials

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A Comparison of Finite vs. Infinite Plane Models of Reference Conductors in Electronic Packages

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps48591.2020.9231434 ◽

2020 ◽

Author(s):

Yi-Ru Jeong ◽

Ali E. Yilmaz

Keyword(s):

Infinite Plane ◽

Electronic Packages

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2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

High-Dimensional Uncertainty Quantification via Active and Rank-Adaptive Tensor Regression

Gauss-Newton Method for Performance Evaluation of Decoupling Capacitors on Resonant Parallel Plates

Reinforcement Learning-based Auto-router considering Signal Integrity

Determine Socket’s Inductance and Contact Resistance by Using PRF Method

Variational Inference approach to Jitter decomposition in High-speed Link

ANN Performance for the Prediction of High-Speed Digital Interconnects over Multiple PCBs

PCIe Gen-5 Design Challenges of High-Speed Servers

On Dissipativity Conditions for Linearized Models of Locally Active Circuit Blocks

Thermal Sensitivity of Dielectric Materials in High-Speed Designs

A Comparison of Finite vs. Infinite Plane Models of Reference Conductors in Electronic Packages

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Latest Publications